Disclosed are a CMP wafer cleaning apparatus, and a wafer transfer manipulator and a wafer overturn method for same. The wafer transfer manipulator includes: a transverse transfer shaft, with same only being located at a side of a cleaning unit; a transverse transfer carriage provided on the transverse transfer shaft, and capable of transversely moving along the transverse transfer shaft; a first vertical lifting shaft provided on the transverse transfer carriage, and capable of vertically moving on the transverse transfer carriage; a rotary table provided on the first vertical lifting shaft; and a first claw clamping arm connected to the rotary table, and driven by the rotary table to move in a rotational manner. The CMP wafer cleaning apparatus is provided, and when the CMP wafer cleaning apparatus fails, safe storage of a polished wafer can be realized.

A storage module includes a substrate support, a sensor, a rotating unit, a storage unit and an elevating unit. The substrate support has a consumable member thereon. The sensor detects an orientation of the consumable member. The rotating unit rotates the consumable member in a predetermined direction based on the orientation of the consumable member detected by the sensor. The storage unit is disposed below the substrate support to store the consumable member. The elevating unit vertically moves the storage unit.

A substrate processing device includes a substrate holding table, an ultraviolet irradiator, a tubular member, a first gas supplying unit, and a second gas supplying unit. The ultraviolet irradiator is disposed facing to the substrate through an active space and configured to irradiate the substrate with ultraviolet light. The tubular member includes an inner surface surrounding a side surface of the substrate holding table, and at least one opening at a position facing to the side surface on the inner surface. The first gas supplying unit supplies gas to a space between the side surface of the substrate holding table and the inner surface of the tubular member through the at least one opening. The second gas supplying unit supplies gas to an active space between the substrate and the ultraviolet irradiator.

An apparatus for processing a substrate includes a first processing unit configured to have a first processing container having a first inner space and a first support unit supporting and rotating the substrate in the first inner space; a second processing unit configured to have a second processing container having a second inner space and a second support unit supporting and rotating the substrate in the second inner space; an exhaust unit configured to exhaust the first and the second inner space; a first exhaust pipe configured to have a first exhaust port for introducing atmosphere of the first inner space and exhaust the atmosphere introduced through the first exhaust port to the integrated duct; and a second exhaust pipe configured to have a second exhaust port for introducing atmosphere of the second inner space and exhaust the atmosphere introduced through the second exhaust port to the integrated duct.

The inventive concept provides a substrate treating apparatus. According to the inventive concept, the substrate treating apparatus treats the substrate by supplying a treating liquid on a rotating substrate. The exhaust unit exhausting an atmosphere of an inner space comprises: a first exhaust port introducing the atmosphere of the inner space, a first exhaust line provided to exhaust an atmosphere introduced through the first exhaust port in a first direction and a second exhaust port introducing the atmosphere of the inner space, and a second exhaust line provided to exhaust an atmosphere introduced through the second exhaust port in a second direction. The controller controls the support unit so an exhaust direction inside of the first exhaust line and the second exhaust line become a forward direction with respect to a rotation direction of the substrate.

A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

A substrate processing apparatus includes a substrate processing unit, a partition wall, a first gas supply, and a second gas supply. The substrate processing unit performs a liquid processing on a substrate. The partition wall separates a first space defined from a carry-in/out port through which the substrate is loaded to the substrate processing unit, and a second space other than the first space. The first gas supply is connected to the partition wall, and supplies an atmosphere adjusting gas to the first space. The second gas supply is connected to a place different from the first gas supply in the partition wall, and supplies an atmosphere adjusting gas to the first space.

Disclosed is a substrate treating apparatus including a transfer chamber for transferring a substrate. The transfer chamber may include a hand on which the substrate is placed, an arm connected to the hand, a first member that supports the hand and the arm and move to transfer the substrate, a second member that supports the first member, a sensor detection member attached to the first member, a sensor member attached to the second member, and a determination unit that determines whether or not transfer is normal in the transfer chamber through a distance between the sensor detection member and the sensor member.

A substrate transfer device and method as well as a photolithography apparatus are disclosed. The device includes a motion platform and a plurality of transfer stages which are arranged side-by-side along a first direction are configured to transfer substrates in a second direction that is perpendicular to the first direction. The motion platform includes a base table and a plurality of motion tables in movable connection with the base table. Each of the transfer stages is connected to, and movable in the first direction with, a corresponding one of the motion tables. A pre-alignment assembly for pre-alignment and positional adjustments of the substrates is provided on the motion platform and on the transfer stages. When one of the transfer stages is unloading a first substrate, another one of the transfer stages receives a second substrate and effectuates its first- and second-directional pre-alignment with the aid of the pre-alignment assembly.