Provided is a heat treatment unit, including: a chamber providing a substrate processing apparatus including: a process chamber in which an upper chamber and a lower chamber are in contact with each other to form a treatment space defined by the upper chamber and the lower chamber; a heating plate positioned in the treatment space to heat a substrate; a lift pin for placing the substrate on the heating plate or for moving the substrate placed on the heating plate to be spaced apart from the heating plate; a driving member connected to the upper chamber or the lower chamber to vertically drive the upper chamber or the lower chamber; an exhaust member connected to a central region of the upper chamber to exhaust the treatment space; and an airflow blocking member provided on an upper surface of the heating plate and formed to surround an edge of the substrate so as to block a surrounding airflow from approaching the edge of the substrate.

Provided is a pump for supplying a liquid, the pump including: a flexible tube body including a pump chamber; first flange provided at one end of the tube body and including an inlet communicating with the pump chamber; a second flange provided at the other end of the tube body and including an outlet communicating with the pump chamber; and driving unit for transmitting rotational force to the tube body to twist the tube body.

There is provided a configuration at least including a screen control part configured to display on a display part a maintenance component management screen displaying a component, a mechanism, or both, as a maintenance component, a collection part configured to collect component data related to the maintenance component, a determination part configured to compare a cumulative value of the component data with a predetermined threshold value to determine the cumulative value exceeding the threshold value, a calculation part configured to calculate a replacement time, and an operation part configured to calculate replacement times based on an average value of the component data and a cumulative value of the component data for each predetermined cycle, display the maintenance component sequentially from the maintenance component reaching the earliest replacement time, and display the maintenance component on the display part in a state where the component data is updated for the predetermined cycle.

A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

A substrate processing apparatus includes a liquid processing unit configured to supply, onto a front surface of a substrate, individual multiple processing liquids different from each other; an exhaust unit configured to exhaust an exhaust gas exhausted from the liquid processing unit to an outside. The exhaust unit includes a main exhaust pipe including a first portion and a second portion, a first individual exhaust pipe, a second individual exhaust pipe, a switching unit and an outside air introduction pipe. The switching unit includes a first switching mechanism, a second switching mechanism, a third switching mechanism provided between the first portion and the second portion of the main exhaust pipe, an outside air introduction pipe connected to the second portion to allow outside air to be introduced into the second portion, and a fourth switching mechanism provided in the outside air introduction pipe.

Described are techniques and equipment (apparatus) for processing an electrostatic chuck at controlled process conditions, including, as an example, for processing an electrostatic chuck during a step of curing an adhesive that forms a bond between two layers of the electrostatic chuck.

The inventive concept relates to a heating member for heating a substrate. In an embodiment, the heating member includes a heater plate having at least one heating element bonded thereto, a connecting plate having a first space formed therein in which the heating element is accommodated, and a control plate having a control element bonded thereto, the control element being electrically connected with the heating element to control the heating element.

A hand for holding the substrate includes a hand main body and a plurality of seating members mounted on the hand main body and on which the substrate is to be seated. Each of the plurality of seating member includes a shaft member supported to the hand main body and a lever member that is supported to the shaft member and includes a first end portion including a seating portion on which the substrate is to be seated and a second end portion disposed on a side opposite to the first end portion across the shaft member. At least a part of the plurality of seating members further includes a biasing member for giving a force of rotating the lever member to the lever member such that the second end portion moves downward and a seating sensor configured to detect an upward movement of the second end portion.

The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.

Provided in the present invention is a coating and development equipment, comprising a cassette module, a first process module, a second process module, and an interface module. A first inter-layer process manipulator, an intra-layer process manipulator group and a second inter-layer process manipulator are arranged between the first process module and the second process module, and the first inter-layer process manipulator, the second inter-layer process manipulator, and manipulators in the intra-layer process manipulator group each have two groups of end effectors facing oppositely, the number of each group of end effectors is m, and m is a natural number greater than or equal to 2, whereby the handling of a plurality of wafers can be realized and the production efficiency can be improved.