There is provided an imaging device, an electronic apparatus including an imaging device, and an automotive vehicle including an electronic apparatus including an imaging device, including: a first substrate including a first set of photoelectric conversion units; a second substrate including a second set of photoelectric conversion units; and an insulating layer between the first substrate and the second substrate; where the insulating layer has a capability to reflect a first wavelength range of light and transmit a second wavelength range of light that is longer than the first wavelength range of light.

An imaging device includes a semiconductor substrate, a first pixel, and second pixels adjacent to the first pixel. Each of the first pixel and the second pixels includes a first photoelectric conversion layer, a first pixel electrode, a first plug that electrically connects the semiconductor substrate and the first pixel electrode, a second photoelectric conversion layer, a second pixel electrode, and a second plug that electrically connects the semiconductor substrate and the second pixel electrode. When the imaging device is viewed in a normal direction of the semiconductor substrate, a smallest distance of distances between the first plug in the first pixel and the first plugs in the respective second pixels is smaller than a smallest distance of distances between the first plug in the first pixel and the second plugs in the first pixel and the respective second pixels.

A unit cell of a focal plane array (FPA) is provided. The unit cell includes a first layer having a first absorption coefficient. The first layer is configured to: sense a first portion of a polarized light of an incident light having a first portion and a second portion, convert the first sensed portion of incident light into a first electrical signal, and pass through a second portion of the incident light. Further, the unit cell includes a second layer having a second absorption coefficient and positioned adjacent to the first layer and configured to receive the second portion of the incident light. The second layer is configured to convert the second portion of the incident light to a second electrical signal. Also, the unit cell includes a readout integrated circuit positioned adjacent to the second layer and configured to receive the first electrical signal and the second electrical signal.

A solid-state imaging device (1) according to the present disclosure includes a photoelectric conversion portion (30) including a first electrode (31), a photoelectric conversion layer (34) electrically connected to the first electrode (31), and a second electrode (35) provided on a surface on a light incidence side of the photoelectric conversion layer (34). The photoelectric conversion layer (34) has a protrusion region (34a) that protrudes from the second electrode (35) when seen in a plan view.

A light conversion device includes a light-emitting unit, a photoelectric conversion unit, and an electroconductive bonding layer. Each of the light-emitting unit and the photoelectric conversion unit includes a first-type region and a second-type region opposite to the first-type region. The electroconductive bonding layer is disposed between the light-emitting unit and the photoelectric conversion unit for connecting the photoelectric conversion unit with the light-emitting unit. When the light conversion device is operated to receive a bias and an external light, the light-emitting unit generates a modulated light having a frequency different from that of the external light.

A device for multispectral imaging in the infrared, suitable for detecting at at least one first and one second detection wavelength is provided. It comprises a detection matrix array comprising a set of elementary detectors of preset dimensions forming an image field of given dimensions; and an image-forming optic having a given aperture number (N) and a given focal length (F), which aperture number and focal length are suitable for forming, at any point of the image field, an elementary focal spot covering a set of at least two juxtaposed elementary detectors. The device furthermore comprises a matrix array of elementary metal-dielectric guided-resonance filters, which matrix array is arranged in front of the detection matrix array at a distance smaller than a focal depth of the optic, the dimensions of the elementary filters being such that each elementary focal spot formed at each point of the image field covers at least two elementary filters; and the elementary filters are optimised for pass-band transmission in spectral bands centred on two different central wavelengths, equal to two of said detection wavelengths.

An optical detector that is sensitive in at least two infrared wavelength ranges: first spectral band and second spectral band; and having a set of pixels, comprising: an absorbent structure disposed on a lower face of a substrate and comprising a stack of at least one absorbent layer made of semi-conductor material; the detector further comprising a plurality of dielectric resonators on the upper surface of said substrate forming an upper surface metasurface, the metasurface configured to diffuse, deflect and focus in the pixels of the detector in a resonant manner, when illuminated by the incident light, a first beam having at least one first wavelength included in the first spectral band and a second beam having at least one second wavelength included in the second band, the metasurface also being configured so that said first and second beams are focused on different pixels of the detector.

An image sensor may include a first photo-sensing device on a semiconductor substrate and configured to sense light of a first wavelength spectrum, and second and third photo-sensing devices integrated in the semiconductor substrate and configured to sense light of a second and third wavelength spectrum, respectively. The first photo-sensing device may overlap each of the second and third photo-sensing devices in a thickness direction of the semiconductor substrate. The second and third photo-sensing devices do not overlap in the thickness direction and each have an upper surface, a lower surface, and a doped region therebetween. The third photo-sensing device includes an upper surface deeper further from the upper surface of the semiconductor substrate than the upper surface of the second photo-sensing device and a doped region thicker than the doped region of the second photo-sensing device. The image sensor may omit the first photo-sensing device.

An electromagnetic radiation spectrum detection system including a sensor device and an electronic control and processing module. The sensor device may include two photodiodes. The sensor device may convert an incident electromagnetic radiation (EMR) into electrical current. The electronic control and processing module may store numerical calibration values representative of a responsivity matrix of the sensor device. The electronic control and processing module may selectively provide the sensor device with electrical control voltage values (V.sub.B). The electronic control and processing module may process the values of detected electric currents (Iph) and the numerical calibration values to obtain spectrum information related to incident electromagnetic radiation spectrums. The electronic control and processing module may determine power spectral density of incident electromagnetic radiation.

An integrated optical sensor is formed by a pinned photodiode. A semiconductor substrate includes a first semiconductor region having a first type of conductivity located between a second semiconductor region having a second type of conductivity opposite to the first type one and a third semiconductor region having the second type of conductivity. The third semiconductor region is thicker, less doped and located deeper in the substrate than the second semiconductor region. The third semiconductor region includes both silicon and germanium. In one implementation, the germanium within the third semiconductor region has at least one concentration gradient. In another implementation, the germanium concentration within the third semiconductor region is substantially constant.