An X-ray device including a sensing panel is provided. The sensing panel includes a first pixel and a second pixel. The second pixel is disposed adjacent to the first pixel in a top view direction. The first pixel includes a first photoelectric conversion layer. The second pixel includes a second photoelectric conversion layer. The first photoelectric conversion layer and the second photoelectric conversion layer belong to different layers.

Disubstituted diaryloxybenzoheterodiazole compound of general formula (I): ##STR00001##
in which: Z represents a sulfur atom, an oxygen atom, a selenium atom; or an NR.sub.5 group in which R.sub.5 is selected from linear or branched C.sub.1-C.sub.20, or from optionally substituted aryl groups; R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are as defined in the claims. The disubstituted diaryloxybenzoheterodiazole compound of general formula (I) can advantageously be used as a spectrum converter in luminescent solar concentrators (LSCs) which are in turn capable of improving the performance of photovoltaic devices (or solar devices) selected, for example, from photovoltaic cells (or solar cells), photovoltaic modules (or solar modules) on either a rigid substrate or a flexible substrate.

Some embodiments include an x-ray detector, comprising: a housing including a front plate; a substrate including a plurality of sensors configured to generate a two-dimensional image; and an x-ray conversion material; wherein the substrate and the x-ray conversion material are disposed within the housing and on the front plate.

The present specification provides a detector for an X-ray imaging system. The detector includes at least one high resolution layer having high resolution wavelength-shifting optical fibers, each fiber occupying a distinct region of the detector, at least one low resolution layer with low resolution regions, and a single segmented multi-channel photo-multiplier tube for coupling signals obtained from the high resolution fibers and the low resolution regions.

A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.

A radiation detector having a plurality of pixels is provided. A respective one of the plurality of pixels includes a base substrate; a thin film transistor on the base substrate; an insulating layer on a side of the thin film transistor away from the base substrate; a photosensor on a side of the insulating layer away from the base substrate; a passivation layer on a side of the photosensor away from the base substrate; a scintillation layer on a side of the passivation layer away from the base substrate; and a reflective layer on a side of the scintillation layer away from the base substrate. The photosensor includes a first polarity layer in direct contact with the passivation layer. All sides of the first polarity layer other than a side internal to the photosensor are entirely in direct contact with the passivation layer.

A radiation imaging apparatus comprising a first scintillator, a second scintillator which receives radiation transmitted through the first scintillator, conversion elements and a controller is provided. The conversion elements include first conversion elements and second conversion elements with different sensitivities for detecting light emitted from at least one of the first scintillator or the second scintillator. During radiation irradiation, the controller obtains, from a signal output from one or more measuring element configured to measure a dose of incident radiation, a first signal corresponding to light converted from radiation by the second scintillator, and outputs, based on the first signal, a stop signal configured to stop the radiation irradiation, and after the radiation irradiation, the controller causes the first conversion elements and the second conversion elements to output signals configured to generate an energy subtraction image.

A digital quantum dot radiographic detection system described herein includes: a scintillation subsystem 202 and a semiconductor light detection subsystem 200, 200′ (including a plurality of quantum dot image sensors 200a, 200b). In a first preferred digital quantum dot radiographic detection system, the plurality of quantum dot image sensors 200 is in substantially direct contact with the scintillation subsystem 202. In a second preferred digital quantum dot radiographic detection system, the scintillation subsystem has a plurality of discrete scintillation packets 212a, 212b, at least one of the discrete scintillation packets communicating with at least one of the quantum dot image sensors. The quantum dot image sensors 200 may be associated with semiconductor substrate 210 made from materials such as silicon (and variations thereof) or graphene.

An object to provide a radiation detector and method for manufacturing a radiation detector. According to an embodiment, a radiation detector includes: a photodiode layer having at least one pixel; and a scintillator layer including at least one geometrical shape including a scintillating material and a polymer, wherein the scintillating material is configured to convert incident ionising radiation into nonionising electromagnetic radiation, and wherein the at least one geometrical shape is configured to guide at least part of the converted electromagnetic radiation into the at least one pixel. A radiation detector and a method for manufacturing a radiation detector are also disclosed.

Provided are an X-ray detector having fabrication fault tolerant structure and a method for manufacturing the same using a micro-transfer printing (MTP) technique. The X-ray detector may include a photodiode layer formed on a base substrate within a pixel area and including a plurality of photodiode pixel units, a dummy layer formed the base substrate within a peripheral area, a plurality of pixel driving integrated chips printed on the photodiode layer, a plurality of primary column and row integrated chips printed on the dummy layer, and metal lines coupling the column and row integrated chips with pixel driving integrated chips and other constituent elements, wherein the plurality of pixel driving integrated chips and primary column and row integrated chips are manufactured separately from the photodiode layer and the dummy layer and attached on the photodiode layer and the dummy layer, respectively.