An Enhancement-Mode HEMT having a gate electrode with a doped, Group III-N material disposed between an electrically conductive gate electrode contact and a gate region of the Enhancement-Mode HEMT, such doped, Group III-N layer increasing resistivity of the Group III-N material to deplete the 2DEG under the gate at zero bias.

A semiconductor integrated circuit device includes: a channel layer, a barrier layer; a first p-type semiconductor layer and a second p-type semiconductor layer, spaced apart from each other on the barrier layer; and a passivation layer on the first p-type semiconductor layer and the second p-type semiconductor layer. The passivation layer may partially inactivate a dopant of at least one of the first p-type semiconductor layer and the second p-type semiconductor layer.

Provided are a semiconductor device and a method for manufacturing same. The device comprises: a substrate, a first insulating layer on the substrate, a plurality of trenches formed in the substrate, a nucleation layer arranged on one side wall of each trench, and a first semiconductor layer formed along the trenches by means of the nucleation layer. The present disclosure facilitates the achievement of one of the following effects: achieving a high height-width ratio and a high integration density, reducing an on-resistance, improving a threshold voltage, achieving a normally-off state, and providing a semiconductor device that has a high power and a high reliability, is suitable for a planarization process, is provided with an easy preparation method, and reduces costs.

A semiconductor device includes a compound semiconductor layer comprising a III-V material; a first layer on the compound semiconductor layer and comprising oxygen, nitrogen, and a material included in the compound semiconductor layer; a second layer over the first layer, wherein at least a portion of the second layer comprises a single crystalline structure or a polycrystalline structure; a dielectric layer over the second layer; and a source/drain electrode extending through the dielectric layer, the second layer, and the first layer and into the compound semiconductor layer.

Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; a plurality of gates disposed on the quantum well stack; and a top gate at least partially disposed on the plurality of gates such that the plurality of gates are at least partially disposed between the top gate and the quantum well stack.

Provided is a compound semiconductor device that can suppress the deterioration of the element characteristics and a method of manufacturing a compound semiconductor device. The compound semiconductor device includes a laminated body constituted of a compound semiconductor and including a channel layer in which a first conductivity type carrier runs; a gate electrode provided on an upper surface side of the laminated body; a source electrode provided on the upper surface side of the laminated body; and a drain electrode provided on the upper surface side of the laminated body. The laminated body includes a second conductivity type first low resistance layer that is provided at a position facing the gate electrode and is in contact with the gate electrode, a first electric-field relaxation layer extended from the first low resistance layer toward a side of one of the source electrode and the drain electrode and configured to relax electric field concentration to the first low resistance layer, and a first amorphous layer covering a first side surface that is a side surface of the first electric-field relaxation layer and faces one of the source electrode and the drain electrode.

Flexible transistors and electronic circuits incorporating the transistors are provided. The flexible transistors promote heat dissipation from the active regions of the transistors while preserving their mechanical flexibility and high-frequency performance. The transistor designs utilize thru-substrate vias (TSVs) beneath the active regions of thin-film type transistors on thin flexible substrates. To promote rapid heat dissipation, the TSVs are coated with a material having a high thermal conductivity that transfers heat from the active region of the transistor to a large-area ground.

A high electron mobility transistor (HEMT) includes a substrate, a P-type III-V composition layer, a gate electrode and a carbon containing layer. The P-type III-V composition layer is disposed on the substrate, and the gate electrode is disposed on the P-type III-V composition layer. The carbon containing layer is disposed under the P-type III-V composition layer to function like an out diffusion barrier for preventing from the dopant within the P-type III-V composition layer diffusing into the stacked layers underneath during the annealing process.

The present disclosure relates generally to structures in semiconductor devices and methods of forming the same. More particularly, the present disclosure relates to semiconductor devices having field plates that are arranged symmetrically around a gate. The present disclosure provides a semiconductor device including an active region above a substrate, source and drain electrodes in contact with the active region, a gate above the active region and laterally between the source and drain electrodes, a first field plate between the source electrode and the gate, a second field plate between the drain electrode and the gate, in which the gate is spaced apart laterally and substantially equidistant from the first field plate and the second field plate.

The present invention relates to a Semiconductor device including a first electrode, a second electrode and at least one semiconductor material or layer between the first and second electrode. The semiconductor device further includes at least one field plate structure for increasing a breakdown voltage of the semiconductor device. The at least one field plate structure comprises at least two recesses in the at least one semiconductor material or layer, the at least two recesses defining a semiconductor region therebetween, and a third electrode contacting or provided on the semiconductor region.