Semiconductor structure including germanium-on-insulator lateral bipolar junction transistors and methods of fabricating the same generally include formation of a silicon passivation layer at an interface between the insulator layer and a germanium layer.

An ESD protection device is fabricated in a semiconductor substrate that includes a semiconductor layer having a first conductivity type. A first well implantation procedure implants dopant of a second conductivity type in the semiconductor layer to form inner and outer sinker regions. The inner sinker region is configured to establish a common collector region of first and second bipolar transistor devices. A second well implantation procedure implants dopant of the first conductivity type in the semiconductor layer to form respective base regions of the first and second bipolar transistor devices. Conduction of the first bipolar transistor device is triggered by breakdown between the inner sinker region and the base region of the first bipolar transistor device. Conduction of the second bipolar transistor device is triggered by breakdown between the outer sinker region and the base region of the second bipolar transistor device.

A bipolar transistor is supported by a substrate including a semiconductor layer overlying an insulating layer. A transistor base is formed by a base region in the semiconductor layer that is doped with a first conductivity type dopant at a first dopant concentration. The transistor emitter and collector are formed by regions doped with a second conductivity type dopant and located adjacent opposite sides of the base region. An extrinsic base includes an epitaxial semiconductor layer in contact with a top surface of the base region. The epitaxial semiconductor layer is doped with the first conductivity type dopant at a second dopant concentration greater than the first dopant concentration. Sidewall spacers on each side of the extrinsic base include an oxide liner on a side of the epitaxial semiconductor layer and the top surface of the base region.

After forming a first trench extending through a top semiconductor layer and a buried insulator layer and into a handle substrate of a semiconductor-on-insulator (SOI) substrate, a dielectric waveguide material stack including a lower dielectric cladding layer, a core layer and an upper dielectric cladding layer is formed within the first trench. Next, at least one lateral bipolar junction transistor (BJT), which can be a PNP BJT, an NPN BJT or a pair of complementary PNP BJT and NPN BJT, is formed in a remaining portion of the top semiconductor layer. After forming a second trench extending through the dielectric waveguide material stack to re-expose a portion of a bottom surface of the first trench, a laser diode is formed in the second trench.

A metal-oxide-semiconductor field-effect transistor (MOSFET) power device includes an active region formed on a bulk semiconductor substrate, the active region having a first conductivity type formed on at least a portion of the bulk semiconductor substrate. A first terminal is formed on an upper surface of the structure and electrically connects with at least one other region having the first conductivity type formed in the active region. A buried well having a second conductivity type is formed in the active region and is coupled with a second terminal formed on the upper surface of the structure. The buried well and the active region form a clamping diode which positions a breakdown avalanche region between the buried well and the first terminal. A breakdown voltage of at least one of the power devices is a function of characteristics of the buried well.

According to one embodiment, a power generation element includes a first conductive layer, a second conductive layer, and a first member. The first member is provided between the first conductive layer and the second conductive layer. The first member includes a first semiconductor having polarity. A gap is between the second conductive layer and the first member. A <000-1> direction of the first semiconductor is oblique to a first direction from the first conductive layer toward the second conductive layer.

Disclosed are a forksheet semiconductor structure and a method of forming the structure. The structure can include a dielectric body with a first sidewall and a second sidewall opposite the first sidewall. The structure can include a first transistor, which incorporates first semiconductor nanosheet(s) positioned laterally immediately adjacent to the first sidewall of the dielectric body, and a second transistor, which incorporates second semiconductor nanosheet(s) positioned laterally immediately adjacent to the second sidewall. The first transistor and the second transistor can both be bipolar junction transistors (BJTs) (e.g., PNP-type BJTs, NPN-type BJTs or a PNP-type BJT and an NPN-type BJT). Alternatively, the first transistor can be a BJT (e.g., a PNP-type BJT or an NPN-type BJT) and the second transistor can be a field effect transistor (FET) (e.g., an N-type FET (NFET) or a P-type FET (PFET)).

The present disclosure relates to semiconductor structures and, more particularly, to a bipolar transistor with self-aligned asymmetric spacer and methods of manufacture. The structure includes: a base formed on a semiconductor substrate; an asymmetrical spacer surrounding the base; an emitter on a first side of the base and separated from the base by the asymmetrical spacer; and a collector on a second side of the base and separated from the base by the asymmetrical spacer.

Structures for a bipolar junction transistor and methods of forming a structure for a bipolar junction transistor. The structure includes a collector having a raised portion, an emitter having a raised portion, and a base laterally arranged between the raised portion of the emitter and the raised portion of the collector. The base includes an intrinsic base layer and an extrinsic base layer stacked with the intrinsic base layer. The structure further includes a stress liner positioned to overlap with the raised portion of the collector, the raised portion of the emitter, and the extrinsic base layer.

The present disclosure relates to semiconductor structures and, more particularly, to a bipolar transistor and methods of manufacture. The structure includes: a collector region in a semiconductor substrate; a base region adjacent to the collector region; and an emitter extending above the base region and comprising semiconductor material and a hardmask surrounding a lower portion of the semiconductor material.