Related to is a thin film transistor and a liquid crystal display device. The thin film transistor comprises a substrate, and a conductive laminate and a light-shielding layer that are both arranged on the substrate, wherein the light-shielding layer is located below and directly opposite to the conductive laminate. The thin film transistor is provided therein with the light-shielding layer for shading light from irradiating the conductive laminate, thereby effectively preventing unfavorable influences imposed on the electrical properties of oxides by illumination, and thus improving the electrical properties of the thin film transistor.

One illustrative method disclosed includes, among other things, forming a layer of insulating material comprising a first insulating material above a substrate and forming a metallization blocking structure in the layer of insulating material at a location that is in a path of a metallization trench to be formed in the layer of insulating material, the metallization blocking structure comprising a second insulating material that is different from the first insulating material. The method also includes forming the metallization trench in the layer of insulating material on opposite sides of the metallization blocking structure and forming a conductive metallization line in the metallization trench on opposite sides of the metallization blocking structure.

A thin film transistor array panel and a method of fabricating the same are described. The thin film transistor array panel has: a substrate; a gate electrode; a semiconductor layer; a source electrode; a drain electrode; an insulating layer; an etch stop layer disposed on the semiconductor layer and the insulating layer; a first electrode portion disposed on the source electrode for covering and protecting the source electrode; a second electrode portion disposed on the drain electrode for covering and protecting the drain electrode. Thus, the fabricating process can be simplified and the fabricating cost is reduced.

A thin film transistor array panel and a method of fabricating the same are described. The thin film transistor array panel has: a substrate; a gate electrode; a semiconductor layer; a source electrode; a drain electrode; an insulating layer; an etch stop layer disposed on the semiconductor layer and the insulating layer; a first electrode portion disposed on the source electrode for covering and protecting the source electrode; a second electrode portion disposed on the drain electrode for covering and protecting the drain electrode. Thus, the fabricating process can be simplified and the fabricating cost is reduced.

A photosensitive detection module is provided, comprising a photosensitive circuit, wherein the photosensitive circuit comprises a first resistive element, a second resistive element, a third resistive element, a fourth resistive element to form a resistor bridge, a first input terminal connected to a node between the first resistive element and the third resistive element, a second input terminal connected to a node between the second resistive element and the fourth resistive element, a first output terminal connected to a node between the first resistive element and the second resistive element, and a second output terminal connected to a node between the third resistive element and the fourth resistive element. All four resistive elements have an identical initial resistance value. The first resistive element and the fourth resistive element are photosensitive resistive elements.

A solid-state image pickup device 1 according to the present invention includes a semiconductor substrate 2 on which a pixel 20 composed of a photodiode 3 and a transistor is formed. The transistor comprising the pixel 20 is formed on the surface of the semiconductor substrate, a pn junction portion formed between high concentration regions of the photodiode 3 is provided within the semiconductor substrate 2 and a part of the pn junction portion of the photodiode 3 is extended to a lower portion of the transistor formed on the surface of the semiconductor substrate 2. According to the present invention, there is provided a solid-state image pickup device in which a pixel size can be microminiaturized without lowering a saturated electric charge amount (Qs) and sensitivity.

An object of the present invention is to provide an organic thin film transistor that has an organic semiconductor film manufactured by using a compound having excellent solubility to an organic solvent and that has excellent carrier mobility, a novel compound, an organic thin film transistor material, an organic semiconductor film, an organic thin film transistor composition, and a method of manufacturing an organic thin film transistor using this. The organic thin film transistor according to the present invention has an organic semiconductor film containing a compound represented by Formula (1).

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An object of the present invention is to provide an organic thin film transistor that has an organic semiconductor film manufactured by using a compound having excellent solubility to an organic solvent and that has excellent carrier mobility, a novel compound, an organic thin film transistor material, an organic semiconductor film, an organic thin film transistor composition, and a method of manufacturing an organic thin film transistor using this. The organic thin film transistor according to the present invention has an organic semiconductor film containing a compound represented by Formula (1).

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A method of forming an electrical device that includes epitaxially growing a first conductivity type semiconductor material of a type III-V semiconductor on a semiconductor substrate. The first conductivity type semiconductor material continuously extending along an entirety of the semiconductor substrate in a plurality of triangular shaped islands; and conformally forming a layer of type III-V semiconductor material having a second conductivity type on the plurality of triangular shaped islands to provide a textured surface of a photovoltaic device. A light emitting diode is formed on the textured surface of the photovoltaic device.

A method of forming an electrical device that includes epitaxially growing a first conductivity type semiconductor material of a type III-V semiconductor on a semiconductor substrate. The first conductivity type semiconductor material continuously extending along an entirety of the semiconductor substrate in a plurality of triangular shaped islands; and conformally forming a layer of type III-V semiconductor material having a second conductivity type on the plurality of triangular shaped islands to provide a textured surface of a photovoltaic device. A light emitting diode is formed on the textured surface of the photovoltaic device.