A method for providing a semiconductor device and the device so formed are described. A doped semiconductor layer is deposited on a semiconductor underlayer. At least a portion of the semiconductor underlayer is exposed. A dopant for the doped semiconductor layer is selected from a p-type dopant and an n-type dopant. An ultraviolet-assisted low temperature (UVLT) anneal of the doped semiconductor layer is performed in an ambient. The ambient is selected from an oxidizing ambient and a nitriding ambient. The oxidizing ambient is used for the n-type dopant. The nitriding ambient is used for the p-type dopant. A sacrificial layer is formed by the doped semiconductor layer during the UVLT anneal. The dopant is driven into the portion of the semiconductor underlayer from the doped semiconductor layer by the UVLT anneal, thereby forming a doped semiconductor underlayer. The sacrificial layer is then removed.

Nanowire structures having non-discrete source and drain regions are described. For example, a semiconductor device includes a plurality of vertically stacked nanowires disposed above a substrate. Each of the nanowires includes a discrete channel region disposed in the nanowire. A gate electrode stack surrounds the plurality of vertically stacked nanowires. A pair of non-discrete source and drain regions is disposed on either side of, and adjoining, the discrete channel regions of the plurality of vertically stacked nanowires.

A semiconductor device includes a first potential supply line for supplying a first potential, a second potential supply line for supplying a second potential lower than the first potential, a functional circuit, and at least one of a first switch disposed between the first potential supply line and the functional circuit and a second switch disposed between the second potential supply line and the functional circuit. The first switch and the second switch are negative capacitance FET.

A semiconductor component is disclosed. The semiconductor component can include: a semiconductor layer injected with a same type of dopant; a gate electrode formed above the semiconductor layer with a gate insulation film positioned in-between; a dielectric layer formed on the semiconductor layer at both sides of the gate electrode; and source/drain electrodes each formed on the dielectric layer.

It is provided a circuit for generating finger print code data comprising: plural pairs of first transistors, each of the first transistors having a source formed in the substrate, a drain formed in the substrate, a channel formed in the substrate between the source and the drain, a gate insulating layer formed on the channel, a gate electrode formed over the gate insulating layer, and an insulating sidewall formed at a side surface of the gate electrode; plural pairs of cross coupled second transistors, each of the plural pairs of cross coupled second transistors having drains and commonly connected sources, corresponding to each of the plural pairs of first transistors; and plural pairs of third transistors, each of the plural pairs of third transistors corresponding to each of the plural pairs of cross coupled second transistors.

A semiconductor device includes a substrate, an epitaxial layer on the substrate, a first well region in the epitaxial layer, a source region in the first well region, a source contact, a base region wrapping around a sidewall of the source contact and a second well region wrapping around the base region. The substrate, the epitaxial layer and the source region include a plurality of dopants of a first semiconductor type. A bottom of the source contact is lower than a bottom of the first well region. The base region and the second well region include a plurality of dopants of a second semiconductor type. The second semiconductor type is different from the first semiconductor type, and a doping concentration of the base region is higher than a doping concentration of the first well region and a doping concentration of the second well region.

The present disclosure relates to a semiconductor device with a contact structure and a method for preparing the semiconductor device. The semiconductor device includes a source/drain structure disposed over a semiconductor substrate, and a dielectric layer disposed over the source/drain structure. The semiconductor device also includes a polysilicon stack disposed over the source/drain structure and surrounded by the dielectric layer. The polysilicon stack includes a first polysilicon layer and a second polysilicon layer disposed over the first polysilicon layer. The first polysilicon layer is undoped, and the second polysilicon layer is doped. The semiconductor device further includes a contact structure disposed directly over the polysilicon stack and surrounded by the dielectric layer.

The present invention provides a method of manufacturing a graphene transistor 101, the method comprising: (a) providing a substrate having a substantially flat surface, wherein the surface comprises an insulating region 110 and an adjacent semiconducting region 105; (b) forming a graphene layer structure 115 on the surface, wherein the graphene layer structure is disposed on and across a portion of both the insulating region and the adjacent semiconducting region; (c) forming a layer of dielectric material 120 on a portion of the graphene layer structure which is itself disposed on the semiconducting region 105; and (d) providing: a source contact 125 on a portion of the graphene layer structure which is itself disposed on the insulating region 110; a gate contact 130 on the layer of dielectric material 120 and above a portion of the graphene layer structure which is itself disposed on the semiconducting region 105; and a drain contact 135 on the semiconducting region 105 of the substrate surface.

The present invention provides a single-gate field effect transistor device and a method for modulating the drive current thereof. The field effect transistor comprises an active layer, a source region and a drain region formed at two sides of the active layer, and a channel region located between the source region and the drain region. The field effect transistor device is configured as follows: when the transistor is turned off, a second channel of depletion-mode spontaneously forms in the channel region, and the second channel does not connect the source region and the drain region; when the transistor is turned on, the second channel and a first channel of the same polarity as the second channel are formed in the channel region; at least one of the first channel and the second channel injects carriers into the other channel so that current conduction occurs between the source and the drain and the carriers of the second channel contribute to the on-state current of the transistor.

A semiconductor device including a field effect transistor (FET) device includes a substrate and a channel structure formed of a two-dimensional (2D) material over the substrate. Source and drain contacts are formed partially over the 2D material. A first dielectric layer is formed at least partially over the channel structure and at least partially over the source and drain contacts. The first dielectric layer is configured to trap charge carriers. A second dielectric layer is formed over the first dielectric layer, and a gate electrode is formed over the second dielectric layer.