A technique is disclosed for causing the top surfaces of solder bumps on a chip to be in the same plane to ensure a more reliable bond between the chip and a substrate. The chip is provided with solder pads that may have different heights. A dielectric layer is formed between the solder pads. A relatively thick metal layer is plated over the solder pads. The metal layer is planarized to cause the top surfaces of the metal layer portions over the solder pads to be in the same plane and above the dielectric layer. A substantially uniformly thin layer of solder is deposited over the planarized metal layer portions so that the top surfaces of the solder bumps are substantially in the same plane. The chip is then positioned over a substrate having corresponding metal pads, and the solder is reflowed or ultrasonically bonded to the substrate pads.

Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion (2) formed on the upper surface of a semiconductor substrate (1), a passivation layer (3) so formed on the upper surface of the semiconductor substrate (1) as to overlap a part of the electrode pad portion (2) and having a first opening portion (3a) where the upper surface of the electrode pad portion (2) is exposed, a barrier metal layer (5) formed on the electrode pad portion (2), and a solder bump (6) formed on the barrier metal layer (5). The barrier metal layer (5) is formed such that an outer peripheral end (5b) lies within the first opening portion (3a) of the passivation layer (3) when viewed in plan.

Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion (2) formed on the upper surface of a semiconductor substrate (1), a passivation layer (3) so formed on the upper surface of the semiconductor substrate (1) as to overlap a part of the electrode pad portion (2) and having a first opening portion (3a) where the upper surface of the electrode pad portion (2) is exposed, a barrier metal layer (5) formed on the electrode pad portion (2), and a solder bump (6) formed on the barrier metal layer (5). The barrier metal layer (5) is formed such that an outer peripheral end (5b) lies within the first opening portion (3a) of the passivation layer (3) when viewed in plan.

A method of fabricating an interconnect structure includes providing a semiconductor structure and performing a first spin resist and bake cycle. The first spin resist and bake cycle includes applying a first predetermined amount of a resist material over one or more portions of the semiconductor structure and baking the semiconductor structure to form a first resist layer portion of a resist layer. The method also includes performing a next spin resist and bake cycle. The next spin resist and bake cycle includes applying a next predetermined amount of the resist material and baking the semiconductor structure to form a next resist layer portion of the resist layer. The method additionally includes depositing a conductive material in an opening formed in the resist layer and forming a conductive structure from the conductive material. An interconnect structure is also provided.

An integrated circuit structure includes a substrate, a PPI over the substrate, a solder region over and electrically coupled to a portion of the PPI, and a molding compound molding a lower portion of the solder region therein. A top surface of the molding compound is level with or lower than a maximum-diameter plane, wherein the maximum-diameter plane is parallel to a major surface of the substrate, and the maximum-diameter of the solder region is in the maximum-diameter plane.

An integrated circuit structure includes a substrate, a PPI over the substrate, a solder region over and electrically coupled to a portion of the PPI, and a molding compound molding a lower portion of the solder region therein. A top surface of the molding compound is level with or lower than a maximum-diameter plane, wherein the maximum-diameter plane is parallel to a major surface of the substrate, and the maximum-diameter of the solder region is in the maximum-diameter plane.

An integrated circuit structure includes a substrate, a PPI over the substrate, a solder region over and electrically coupled to a portion of the PPI, and a molding compound molding a lower portion of the solder region therein. A top surface of the molding compound is level with or lower than a maximum-diameter plane, wherein the maximum-diameter plane is parallel to a major surface of the substrate, and the maximum-diameter of the solder region is in the maximum-diameter plane.

An integrated circuit structure includes a substrate, a PPI over the substrate, a solder region over and electrically coupled to a portion of the PPI, and a molding compound molding a lower portion of the solder region therein. A top surface of the molding compound is level with or lower than a maximum-diameter plane, wherein the maximum-diameter plane is parallel to a major surface of the substrate, and the maximum-diameter of the solder region is in the maximum-diameter plane.