Semiconductor devices having mechanical pillar structures, such as angled pillars, that are rectangular and oriented with respect to a semiconductor die to reduce bending stress and in-plane shear stress at a semiconductor die to which the angled pillars are attached, and associated systems and methods, are disclosed herein. The semiconductor device can include angled pillars coupled to the semiconductor die and to a package substrate. The angled pillars can be configured such that they are oriented relative to a direction of local stress to increase section modulus.

Semiconductor devices having mechanical pillar structures, such as angled pillars, that are rectangular and oriented with respect to a semiconductor die to reduce bending stress and in-plane shear stress at a semiconductor die to which the angled pillars are attached, and associated systems and methods, are disclosed herein. The semiconductor device can include angled pillars coupled to the semiconductor die and to a package substrate. The angled pillars can be configured such that they are oriented relative to a direction of local stress to increase section modulus.

A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.

An integrated fan-out package including an integrated circuit, a plurality of memory devices, an insulating encapsulation, and a redistribution circuit structure is provided. The memory devices are electrically connected to the integrated circuit. The integrated circuit and the memory devices are stacked, and the memory devices are embedded in the insulating encapsulation. The redistribution circuit structure is disposed on the insulating encapsulation, and the redistribution circuit structure is electrically connected to the integrated circuit and the memory devices. Furthermore, methods for fabricating the integrated fan-out package are also provided.

An electronic device includes a substrate and first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. Centers of the first ends of the first bumps are on a first axial line. A first axial coordinate of a center of the second end of a respective first bump relative to a second axial line perpendicular to the first axial line is X.sub.A(1+β.sub.AY.sub.A), in which X.sub.A is a first axial coordinate of the center of the first end of the respective first bump relative to the second axial line, Y.sub.A is a second axial coordinate of the center of the second end of the respective first bump relative to the first axial line, and β.sub.A is a slope coefficient of the respective first bump.

Embodiments that allow both high density and low density interconnection between microelectronic die and motherboard via. Direct Chip Attach (DCA) are described. In some embodiments, microelectronic die have a high density interconnect with a small bump pitch located along one edge and a lower density connection region with a larger bump pitch located in other regions of the die. The high density interconnect regions between die are interconnected using an interconnecting bridge made out of a material that can support high density interconnect manufactured into it, such as silicon. The lower density connection regions are used to attach interconnected die directly to a board using DCA. The high density interconnect can utilize current Controlled Collapsed Chip Connection (C4) spacing when interconnecting die with an interconnecting bridge, while allowing much larger spacing on circuit boards.

Semiconductor devices having mechanical pillar structures, such as angled pillars, that are rectangular and orientated with respect to a semiconductor die to reduce bending stress and in-plane shear stress at a semiconductor die to which the angled pillars are attached, and associated systems and methods, are disclosed herein. The semiconductor device can include angled pillars connected to the semiconductor die and to a package substrate. The angled pillars can be configured such that they are orientated relative to a direction of local stress to increase section modulus.

Semiconductor devices having mechanical pillar structures, such as angled pillars, that are rectangular and orientated with respect to a semiconductor die to reduce bending stress and in-plane shear stress at a semiconductor die to which the angled pillars are attached, and associated systems and methods, are disclosed herein. The semiconductor device can include angled pillars connected to the semiconductor die and to a package substrate. The angled pillars can be configured such that they are orientated relative to a direction of local stress to increase section modulus.

Among other things, a method of fabricating an integrated electronic device package is described. First trace portions of an electrically conductive trace are formed on an electrically insulating layer of a package structure, and vias of the conductive trace are formed in a sacrificial layer disposed on the electrically insulating layer. The sacrificial layer is removed, and a die is placed above the electrically insulating layer. Molding material is formed around exposed surfaces of the die and exposed surfaces of the vias, and a magnetic structure is formed within the layer of molding material. Second trace portions of the electrically conductive trace are formed above the molding material and the magnetic structure. The electrically conductive trace and the magnetic structure form an inductor. The electrically conductive trace may have a coil shape surrounding the magnetic structure. The die may be positioned between portions of the inductor.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.