The present disclosure provides a method and a system for assembling microelectronic components. The method includes: a substrate including a first surface is provided, the first surface includes a plurality of first areas and a second area surrounding each first area, the first area has a lyophilic surface, and the second area has a lyophobic surface; a plurality of adhesive liquid droplets automatically form on the first areas; and a plurality of microelectronic components on a carrier plate transferred onto the adhesive liquid droplets, wherein the microelectronic components are automatically aligned with the first areas to obtain an assembled structure.

A chip package structure is provided. The chip package structure includes a first redistribution layer having a bonding portion. The bonding portion includes a dielectric layer. The chip package structure includes a chip structure bonded to the bonding portion. A first width of the dielectric layer of the bonding portion is substantially equal to a second width of the chip structure. The chip package structure includes a protective layer over the first redistribution layer and surrounding the chip structure. A portion of the protective layer extends into the first redistribution layer and surrounds the bonding portion.

A chip package structure is provided. The chip package structure includes a first redistribution layer having a first bonding portion and a chip structure bonded to the first bonding portion. A first width of the first bonding portion is substantially equal to a second width of the chip structure, and the chip structure includes a semiconductor substrate. The chip package structure also includes a second redistribution layer connected between the semiconductor substrate and the first bonding portion. The second redistribution layer has a second bonding portion and a first portion between the second bonding portion and the semiconductor substrate. The second bonding portion is connected to the first bonding portion. The first portion has a first sidewall and a second sidewall opposite to the first sidewall, and the second bonding portion is between the first sidewall and the second sidewall.