A package structure is provided. The package structure includes a chip structure and a first adhesive element partially covering the chip structure. The first adhesive element has a first portion and a second portion, and the first portion is spaced apart from the second portion. The first adhesive element has a first thermal conductivity. The package structure also includes a second adhesive element partially covering the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is higher than the first thermal conductivity.

A splicing display panel is provided. In the present application, at least two light-emitting diode (LED) substrates are disposed on a driving substrate. The driving substrate includes a first conductive pad and a power signal line disposed on a first base. In each LED substrate, a connecting line layer is disposed on a second base and is electrically connected to the power signal line, and LED elements are disposed on the second base, wherein a first electrode of the LED element is electrically connected to the connecting line layer, and a second electrode of the LED element is electrically connected to the first conductive pad.