Examples herein describe integrated photonics circuitry. The integrated photonics circuitry includes an interposer structure mounted on a substrate, a glass chiplet of the interposer structure, and an electrical and photonic integrated circuit (EPIC). The EPIC has a first portion disposed on the glass chiplet and a second portion disposed over the substrate. The glass chiplet includes a waveguide. The waveguide is coupled to the EPIC.

A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.

A semiconductor package may be provided. The semiconductor package may include a package substrate, a semiconductor chip on the package substrate, a solder resist pattern disposed between the package substrate and the semiconductor chip, the solder resist pattern having an opening region, an alignment mark disposed on the package substrate, the alignment mark in the opening region, and a solder paste pattern on a side surface of the alignment mark adjacent to the semiconductor chip, wherein the solder paste pattern is disposed between the semiconductor chip and the package substrate.