Aspects of the present disclosure relate to a molded electronic package and a method for manufacturing the same. The molded electronic package includes a first substrate, a second substrate, an electronic component arranged on the first substrate, a spring member arranged between the second substrate and the electronic component, the spring member including a first contact portion being fixated relative to the second substrate, and a second contact portion physically contacting the electronic component, and a body of solidified molding compound configured to encapsulate the electronic component and the spring member and to mutually fixate the first substrate, the second substrate, the electronic component and the spring member. The second substrate and the spring member are electrically and/or thermally conductive.

A semiconductor device includes: a baseplate; an insulating substrate on the baseplate; a semiconductor element on the insulating substrate; a case bonded to the baseplate by an adhesive, the case surrounding a space in which the semiconductor element is positioned; and an encapsulating material filling the space surrounded by the case, in which, the case includes a claw, the claw includes: a protrusion protruding from an inner wall surface of the case; and a hook inclined from the protrusion, a space being sandwiched between the hook and the inner wall surface of the case.

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.

A semiconductor device includes a heat dissipating component and a semiconductor module. The semiconductor module includes: a metal plate bonded to a bonded region on the upper surface of the heat dissipating component via a bonding material; an insulating layer disposed on an upper surface of the metal plate; a metal component disposed on an upper surface of the insulating layer; a semiconductor element disposed on an upper surface of the metal component; and a sealant sealing the metal plate, the insulating layer, the metal component, and the semiconductor element with a lower surface of the metal plate being exposed. The heat dissipating component includes a step formed around an outer periphery of the bonded region so that the outer periphery is lower than the bonded region, and a resin for protecting a bonded portion between the semiconductor module and the heat dissipating component is applied to the step.

A semiconductor device assembly includes a die stack, a plurality of thermoset regions, and underfill material. The die stack includes at least first and second dies that each have a plurality of conductive interconnect elements on upper surfaces. A portion of the interconnect elements are connected to through-silicon vias that extend between the upper surfaces and lower surfaces of the associated dies. The plurality of thermoset regions each comprise a thin layer of thermoset material extending from the lower surface of the second die to the upper surface of the first die, and are laterally-spaced and discrete from each other. Each of the thermoset regions extends to fill an area between a plurality of adjacent interconnect elements of the first die. The underfill material fills remaining open areas between the interconnect elements of the first die.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

Provided is a resin-sealed semiconductor device that can regulate the thickness of a joining material joining a semiconductor element and a lead frame and inhibit the joining material from leaking out of a proper range. The resin-sealed semiconductor device includes a second lead frame joined via a second joining material above a semiconductor element joined above a heat spreader. The second lead frame has, on a surface thereof opposed to the semiconductor element, a protrusion to regulate a thickness of the second joining material, and a groove formed at a peripheral part of the second joining material.

A semiconductor package may include: a substrate having a first side and a second side on a same plane; a first semiconductor chip disposed over the second side of the substrate; a first one-side third semiconductor chip stack disposed over the first side of the substrate and spaced apart from the first semiconductor chip; a second semiconductor chip stack disposed over the first semiconductor chip and the first one-side third semiconductor chip stack, the second semiconductor chip stack including one or more second semiconductor chips; and a second one-side third semiconductor chip stack disposed over the second semiconductor chip stack, wherein each of the third semiconductor chip stacks includes a plurality of third semiconductor chips that are offset-stacked, offset towards the first side as the third semiconductor chips are farther from the substrate, each of the third semiconductor chip stacks being electrically connected to the substrate.

A method of manufacturing a WBGA package includes providing a carrier having a first surface and a second surface opposite to the first surface of the carrier, wherein the carrier has a through hole extending between the first surface and the second surface of the carrier; disposing an electronic component on the second surface of the carrier, wherein the electronic component includes a first bonding pad and a second bonding pad; and electrically connecting the first bonding pad and the second bonding pad through a first bonding wire.

A display device includes: a display panel including first pads arranged along a first direction, and second pads spaced apart from the first pads; a first connection circuit board electrically connected to the first pads; and a second connection circuit board electrically connected to the second pads. The first connection circuit board includes: first output pads electrically connected to the first pads; and at least two first protrusion parts spaced along the first direction and protruding in a second direction crossing the first direction. The second connection circuit board includes: second output pads electrically connected to the second pads; and at least one second protrusion part protruding in the second direction, and located between the first protrusion parts when viewed on a plane that is parallel to a surface of the display panel.