The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component (14) which is arranged on an upper side of an electrically conductive intermediate plate (16) such that a connector pad (18) of the semiconductor component (14) is electrically contacted with the intermediate plate (16) and comprising a second semiconductor component (15) which is arranged on a lower side of the intermediate plate (16). The second semiconductor component (15) comprises a first connector pad (17) and a second connector pad (19), wherein both connector pads (17, 19) are aligned in the direction of the intermediate plate (16) and wherein the first connector pad (17) is contacted with the intermediate plate (16), and wherein the second connector pad (19) is not contacted with the intermediate plate (16). Moreover, the invention relates to a method for producing such a printed circuit board element.

A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third package component and the second package component. The first underfill and the second underfill are different types of underfills.

A multilayer board includes a base including insulating layers stacked in a stacking direction, and a mounting surface at an end of the base in a first direction along the stacking direction, an electronic component inside the base, and a first heat dissipator extending through at least one of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction to the mounting surface. When a section of the first heat dissipator is defined as a first section, and a section of the first heat dissipator located farther in a second direction along the layer stacking direction than the first section is defined as a second section, there is a combination of a first section and a second section in which the second section extends farther outward than the first section when viewed from the layer stacking direction.

A semiconductor package is disclosed. The semiconductor package comprises a lower package including a first substrate and a semiconductor chip on the first substrate, a second substrate on the lower package, interconnect terminals between the first substrate and the second substrate, and an adhesive pattern between a top surface of the semiconductor chip and a bottom surface of the second substrate. The adhesive pattern extends along an edge of the semiconductor chip. The adhesive pattern exposes a top surface of a central zone of the semiconductor chip.

An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality of joint portions at which a plurality of electrodes formed on the electrode surface are joined to the substrate. A no-electrode surface of the horizontal semiconductor chip and a heatsink are joined together through a second joint portion at which the no-electrode surface and the heatsink are joined together. In a plan view from a direction normal to a principal surface of the substrate, when a region inside the outline of the rough shape of an aggregate of the first joint portions is a first joint region and a region inside the outline of the second joint portion is a second joint region, the first joint region and the second joint region are the same in position, shape, and size.

An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality of joint portions at which a plurality of electrodes formed on the electrode surface are joined to the substrate. A no-electrode surface of the horizontal semiconductor chip and a heatsink are joined together through a second joint portion at which the no-electrode surface and the heatsink are joined together. In a plan view from a direction normal to a principal surface of the substrate, when a region inside the outline of the rough shape of an aggregate of the first joint portions is a first joint region and a region inside the outline of the second joint portion is a second joint region, the first joint region and the second joint region are the same in position, shape, and size.

A semiconductor device includes a substrate, a lid, a semiconductor package and a thermal conductive bonding layer. The lid is attached to the substrate, wherein the lid has a first cavity and a second cavity extending from the first cavity to inside of the lid. The semiconductor package is disposed in the first cavity, below the second cavity and electrically connected to the substrate. The semiconductor package includes at least one semiconductor die, and the second cavity is disposed adjacent to periphery of the at least one semiconductor die in a top view of the semiconductor device. The thermal conductive bonding layer attaches the lid to the semiconductor package and extends into at least a portion of the second cavity.

A semiconductor package is disclosed. The semiconductor package comprises a lower package including a first substrate and a semiconductor chip on the first substrate, a second substrate on the lower package, interconnect terminals between the first substrate and the second substrate, and an adhesive pattern between a top surface of the semiconductor chip and a bottom surface of the second substrate. The adhesive pattern extends along an edge of the semiconductor chip. The adhesive pattern exposes a top surface of a central zone of the semiconductor chip.

The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component (14) which is arranged on an upper side of an electrically conductive intermediate plate (16) such that a connector pad (18) of the semiconductor component (14) is electrically contacted with the intermediate plate (16) and comprising a second semiconductor component (15) which is arranged on a lower side of the intermediate plate (16). The second semiconductor component (15) comprises a first connector pad (17) and a second connector pad (19), wherein both connector pads (17, 19) are aligned in the direction of the intermediate plate (16) and wherein the first connector pad (17) is contacted with the intermediate plate (16), and wherein the second connector pad (19) is not contacted with the intermediate plate (16). Moreover, the invention relates to a method for producing such a printed circuit board element.

A die stack assembly includes first and second power semiconductor device dice. The first die has a P type peripheral edge separation structure that extends from the top planar semiconductor surface of the first die all the way to the bottom planar semiconductor surface of the die, and that is doped at least in part with aluminum. The backside of the first die is mounted to the backside of the second die. A metal feature that is not covered with passivation, and that can serve as a bonding pad, is disposed on part of the peripheral edge separation structure. A metal member (for example, a bond wire or metal clip) contacts the metal feature such that an electrical connection is established from the metal member, through the metal feature, through the peripheral edge separation structure of the first die, and to an electrode of the second die.