A wire bonding apparatus includes: a first tensioner which forms, nearer a wire supply side than a bonding tool, a first gas flow for applying a tension toward the wire supply side on a wire; a second tensioner which forms, between the first tensioner and a pressing part of the bonding tool, a second gas flow for applying a tension toward the wire supply side on the wire; and a control part which controls the first tensioner and the second tensioner. The control part implements control, in a predetermined period after a first bonding step for bonding the wire to a first bonding point, to turn off at least the second gas flow of the second tensioner among the first tensioner and the second tensioner or to make at least the second gas flow smaller than in the first bonding step.

A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the steps of: collecting operating characteristics of a bonding tool while forming a wire bond which bonds a wire to a surface; determining whether a possible bonding failure of the wire bond has occurred as indicated by the operating characteristics; and capturing an image of the wire bond to identify whether a foreign body is present on the surface if it is determined that a possible bonding failure has occurred. In this way, imaging of the wire bond is only necessary when the operating characteristics indicate a suspect bonding failure has occurred. This avoids the need to image every bond, while still imaging suspect bonds. This approach helps to significantly increase the throughput of the wire bonding apparatus whilst still identifying and classifying bonding defects due to the presence of a foreign body.

A discharge examination device for examining discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire to procure the discharge therebetween includes a current detection unit, a timer unit and a discharge determination unit. The current detection unit detects a discharge current flowing through the wire. The timer unit measures discharge detection time after application of the voltage before detection of the discharge current. The discharge determination unit determines whether or not the discharge is abnormal based on the discharge detection time. With this, a discharge examination device, a wire-bonding apparatus, and a discharge examination method that are capable of detecting abnormality of discharge are provided.

There is provided a capillary transport device capable of inserting, without manpower, a capillary into a mounting section of an ultrasonic horn. According to an aspect of the present invention, a capillary transport device includes: a first tube 17 for transporting a capillary 13; an ultrasonic horn 11 with a mounting section for mounting the capillary; a first movement mechanism for relatively moving the ultrasonic horn and a first end 17a of the first tube; and a mechanism for blowing gas into a second end 17b of the first tube.

There is provided a capillary transport device capable of inserting, without manpower, a capillary into a mounting section of an ultrasonic horn. According to an aspect of the present invention, a capillary transport device includes: a first tube 17 for transporting a capillary 13; an ultrasonic horn 11 with a mounting section for mounting the capillary; a first movement mechanism for relatively moving the ultrasonic horn and a first end 17a of the first tube; and a mechanism for blowing gas into a second end 17b of the first tube.

A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the capillary. The controller positions the capillary with respect to the workpiece based on the first image, and calculates a positioning correction amount of the capillary based on the second image.

A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200? or more.

A wire bonding method comprises: preparing a wire bonding apparatus; a step of forming a free air ball; a first height measuring step of measuring the height of a first electrode by detecting whether the free air ball is grounded to the first electrode; a second height measuring step of measuring the height of a second electrode by detecting whether the free air ball is grounded to the second electrode; a first bonding step of controlling the height of a bonding tool based on the measurement result in the first height measuring step, and bonding the free air ball to the first electrode; and a second bonding step of controlling the height of the bonding tool based on the measurement result in the second height measuring step, and bonding a wire to the second electrode to connect the first and the second electrodes. Thus, electrodes can be correctly bonded.

A ball forming device 50 for forming a ball 43 at a tip of a wire 42 by producing discharge between a torch electrode 48 and the tip of the wire 42, the device includes: a current supply unit 54 configured to supply a ball-forming current between the torch electrode 48 and the tip of the wire 42; and a current control unit 57 configured to control the current supply unit 54, so that a signal of the ball-forming current for a predetermined period includes a first period in which the signal takes a predetermined current value and a second period including a triangle wave. With this, it is possible to provide a ball forming device, a wire-bonding apparatus, and a ball formation method that are capable of suppressing formation of deformed balls.

A method for calibrating a wire clamp device includes: preparing a wire clamp device provided with a pair of arm parts having tips for clamping a wire, the arms extending from the tips toward base ends, and a drive part provided with a piezoelectric element for drive, connected to the base ends of the pair of arm parts and opening/closing the tips of the pair of arm parts; a step of detecting, by electrical continuity between the tips, a timing at which the pair of arm parts enters a closed state when the piezoelectric element for drive is driven, and acquiring a reference voltage; and a step of calibrating, on the basis of the reference voltage, an application voltage to be applied to the piezoelectric element for drive. Thus, it is possible to perform accurate and stable wire bonding.