A video wall module includes a plurality of light emitting diode chips, each including first contact electrodes and second contact electrodes arranged at a contact side, wherein the light emitting diode chips are arranged at a top side of a multilayer circuit board, and the contact electrodes electrically conductively connect to a first metallization layer arranged at the top side of the circuit board.

A method of manufacturing a semiconductor package, the method includes preparing a first semiconductor chip including a plurality of first upper connection pads, disposing a plurality of connection bumps electrically connected to the plurality of first upper connection pads on the first semiconductor chip, forming an insulating adhesive layer at least partially covering the plurality of connection bumps on an upper surface of the first semiconductor chip, removing a plurality of regions to be removed of the insulating adhesive layer, and bonding a second semiconductor chip including a plurality of second lower connection pads on the insulating adhesive layer, wherein each of the plurality of regions to be removed is a portion of the insulating adhesive layer that at least partially overlaps a connection bump among the plurality of corresponding connection bumps in a vertical direction.