A power module package is provided. The power module package may include: a first substrate; a second substrate; a semiconductor chip disposed between the first substrate and the second substrate; and a mutual-connection layer that is formed between the semiconductor chip and the second substrate and provides conductive connection between the semiconductor chip and the second substrate.

Semiconductor die assemblies having interconnect structures with redundant electrical connectors are disclosed herein. In one embodiment, a semiconductor die assembly includes a first semiconductor die, a second semiconductor die, and an interconnect structure between the first and the second semiconductor dies. The interconnect structure includes a first conductive film coupled to the first semiconductor die and a second conductive film coupled to the second semiconductor die. The interconnect structure further includes a plurality of redundant electrical connectors extending between the first and second conductive films and electrically coupled to one another via the first conductive film.

Semiconductor die assemblies having interconnect structures with redundant electrical connectors are disclosed herein. In one embodiment, a semiconductor die assembly includes a first semiconductor die, a second semiconductor die, and an interconnect structure between the first and the second semiconductor dies. The interconnect structure includes a first conductive film coupled to the first semiconductor die and a second conductive film coupled to the second semiconductor die. The interconnect structure further includes a plurality of redundant electrical connectors extending between the first and second conductive films and electrically coupled to one another via the first conductive film.

A light emitting device module includes a substrate, a plurality of light emitting devices mounted on the substrate, an adhesive layer interposed between the substrate and the light emitting device; and bonding wires electrically connecting the plurality of light emitting devices. The substrate includes an outer electrode in at least a partial region, and the adhesive layer has a non-conductive material.

A light emitting device module includes a substrate, a plurality of light emitting devices mounted on the substrate, an adhesive layer interposed between the substrate and the light emitting device; and bonding wires electrically connecting the plurality of light emitting devices. The substrate includes an outer electrode in at least a partial region, and the adhesive layer has a non-conductive material.

A semiconductor package includes a first semiconductor die, a second semiconductor die and a plurality of bumps. The first semiconductor die has a front side and a backside opposite to each other. The second semiconductor die is disposed at the backside of the first semiconductor die and electrically connected to first semiconductor die. The plurality of bumps is disposed at the front side of the first semiconductor die and physically connects first die pads of the first semiconductor die. A total width of the first semiconductor die may be less than a total width of the second semiconductor die.

A semiconductor package includes a first semiconductor die, a second semiconductor die and a plurality of bumps. The first semiconductor die has a front side and a backside opposite to each other. The second semiconductor die is disposed at the backside of the first semiconductor die and electrically connected to first semiconductor die. The plurality of bumps is disposed at the front side of the first semiconductor die and physically connects first die pads of the first semiconductor die. A total width of the first semiconductor die may be less than a total width of the second semiconductor die.

A semiconductor package includes a first substrate, a first flow channel and a second flow channel. The first flow channel is on the first substrate. The second flow channel is on the first substrate and in fluid communication with the first flow channel. The second flow channel is spaced from an inlet and an outlet of the first flow channel. The first flow channel and the second flow channel constitute a bonding region of the first substrate.

A semiconductor package includes a first substrate, a first flow channel and a second flow channel. The first flow channel is on the first substrate. The second flow channel is on the first substrate and in fluid communication with the first flow channel. The second flow channel is spaced from an inlet and an outlet of the first flow channel. The first flow channel and the second flow channel constitute a bonding region of the first substrate.

A power module package is provided. The power module package may include: a first substrate; a second substrate; a semiconductor chip disposed between the first substrate and the second substrate; and a mutual-connection layer that is formed between the semiconductor chip and the second substrate and provides conductive connection between the semiconductor chip and the second substrate.