A producing apparatus and a pre-bonding device are provided. The pre-bonding device includes a dispensing mechanism and a die-placing mechanism that is arranged adjacent to the dispensing mechanism. The dispensing mechanism is configured to form a plurality of adhesives onto a plurality of carriers, respectively. The die-placing mechanism includes a plurality of catchers configured to respectively hold a plurality of chips and a correction unit that is configured to adjust a relative position of the chips. The catchers are configured to synchronously place the chips adjusted by the correction unit onto the adhesives, respectively.

A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. The method may comprise: providing a donor substrate comprising the plurality of micro devices, transferring the plurality of micro devices to an intermediate substrate, aligning a selected set of micro devices on the intermediate substrate proximal to the system substrate, providing a photo-sensitive layer between the selected set of micro devices and the system receiver; turning on the selected micro devices, curing the photo-sensitive layer in between the selected set of micro devices and the system substrate by light emitted by the selected micro devices; and bonding the selected set of micro devices to the corresponding contact pads on the system substrate.

A semiconductor package includes a circuit board mounting a first semiconductor chip and a second semiconductor chip laterally separated by an intermediate space, an underfill including an extended portion protruding upward into the intermediate space, a surface modification layer on opposing side surfaces of the first semiconductor chip and the second semiconductor chip, wherein wettability of the underfill with respect to the surface modification layer is less than wettability of the underfill with respect to the side surfaces of the first semiconductor chip and the second semiconductor chip, and a molding member on the upper surface of the circuit board, covering an upper surface of the extended portion of the underfill, and surrounding the first semiconductor chip and the second semiconductor chip.

A semiconductor package includes a circuit board mounting a first semiconductor chip and a second semiconductor chip laterally separated by an intermediate space, an underfill including an extended portion protruding upward into the intermediate space, a surface modification layer on opposing side surfaces of the first semiconductor chip and the second semiconductor chip, wherein wettability of the underfill with respect to the surface modification layer is less than wettability of the underfill with respect to the side surfaces of the first semiconductor chip and the second semiconductor chip, and a molding member on the upper surface of the circuit board, covering an upper surface of the extended portion of the underfill, and surrounding the first semiconductor chip and the second semiconductor chip.

Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a redistribution substrate that includes a chip region and an edge region around the chip region, and a semiconductor chip on the chip region of the redistribution substrate. The redistribution substrate includes a plurality of dielectric layers that are vertically stacked, a plurality of redistribution patterns on the chip region and in each of the dielectric layers, and a redistribution test pattern on the edge region and at a level the same as a level of at least one of the redistribution patterns.

A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.