A manufacturing method of a semiconductor package includes at least the following steps. A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution structure through a die attach material, where a thickness of a portion of the die attach material filling a gap between the rear surface of the semiconductor die and a recessed area of the patterned dielectric layer is greater than a thickness of another portion of the die attach material interposed between the rear surface of the semiconductor die and a non-recessed area of the patterned dielectric layer. An insulating encapsulant is formed on the patterned dielectric layer of the first redistribution structure to cover the semiconductor die and the die attach material. Other methods for forming a semiconductor package are also provided.

A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a semiconductor device, a lid, and a thermal interface material. The interposer substrate is disposed on the carrier substrate. The semiconductor device is disposed on the interposer substrate. The lid is disposed on the carrier substrate to cover the semiconductor device. The thermal interface material is disposed between the lid and the semiconductor device. A first recess is formed on a lower surface of the lid facing the semiconductor device, and the first recess overlaps the semiconductor device in a top view.

A display panel of micro LEDs which provides a means of testing the installed micro LEDs for illumination qualities before final connections are made includes a transparent substrate, a plurality of electrode blocks on the transparent substrate, a plurality of conductive bonding blocks, and the micro LEDs. Each electrode block includes a slit allowing light to pass through. Each bonding block is on a surface of one electrode block away from the transparent substrate and is partially embedded in the slit of one corresponding electrode block. Each micro LED is fixed on one electrode block by a corresponding bonding block and is electrically connected with the electrode block. A method of manufacturing the display panel is further provided.

A device to attract and hold microscopic items such as micro LEDs magnetically rather than by static electricity includes a substrate and a plurality of magnetic units on a surface of the substrate. The magnetic units are spaced apart from each other and are constrained in the size and direction of their individual magnetic fields. Each of the magnetic units includes a magnet and a cladding layer partially covering the magnet. The cladding layer is made of a magnetic material. A side of the magnet away from the substrate is exposed from the cladding layer to attract and hold one micro LED.

Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

A method of manufacturing an electronic package is disclosed. The described method includes (a) placing an electronic component on at least one layer structure; (b) encapsulating the electronic component by an encapsulant in a pressureless way; and (c) forming at least one further layer structure at the layer structure to thereby form a stack beneath the encapsulated electronic component. A further described electronic package includes (a) a stack comprising at least one layer structure and at least one further layer structure; (b) an electronic component being placed on the stack; and (c) an encapsulant encapsulating the electronic component, wherein the encapsulant has been formed in a pressureless way. Further described is an electronic device comprising such an electronic package.

A transparent display panel, a method for manufacturing the same, and a transparent display device are provided. the transparent display panel includes a first display substrate including: a first substrate and first pixel units thereon; and a second display substrate including: a second substrate and second pixel units thereon, the second pixel units are in one-to-one correspondence with the first pixel units, each first pixel unit includes a first display unit and a first transparent unit, and each second pixel unit includes a second display unit and a second transparent unit, an orthographic projection of the first display unit on the second substrate substantially coincides with that of the corresponding second display unit on the second substrate, and an orthographic projection of the first transparent unit on the second substrate substantially coincides with that of the corresponding second transparent unit on the second substrate.

An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.

An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.