The present invention discloses a dielectric filter with multilayer resonator, including a dielectric block, a plurality of multilayer resonator formed in the dielectric block, wherein each multilayer resonator is in a column shape extending in a first direction into the dielectric block and is formed of multiple metal layers paralleling and overlapping each other in a second direction, and vias extend in the second direction and connecting the metal layers in each multilayer resonator, and a ground electrode connected to the ground terminal of each multilayer resonator.

The disclosure relates to a filter including dielectric substrate, ground and microstrip line layers, and signal and ground vias. The ground layer is formed on the dielectric substrate and has a ground plane and signal terminal contacts. The microstrip line layer is located on the dielectric substrate and includes microstrip resonators, common electrode and input and output terminal contacts. The input and output terminal contacts are connected to the microstrip resonators. The signal and ground vias extend among the ground layer, the dielectric substrate, and the microstrip line layer. The signal terminal contacts are connected to the input and output terminal contacts through the signal vias. The ground plane is connected to the common electrode through the ground vias. The filter further includes at least one capacitive coupling unit capacitive-coupled with two of the microstrip resonators adjacent to each other.

A radio frequency filter is disclosed. According to one aspect, the filter includes N stacked planar dielectric layers, N being an integer greater than 1. The filter also includes a first pair of coupled stripline resonators lying in a plane between 5 a first pair of planar dielectric layers. The filter also includes an outermost ground plane on either side of the stack of N stacked planar dielectric layers.

The present invention provides a compact filter with excellent characteristics. This filter has a plurality of resonators, each of which having: via electrode parts formed inside a dielectric substrate; and a first strip line that faces a first shielding conductor of a plurality of shielding conductors formed so as to surround the via electrode parts, the first strip line being connected to one end of the via electrode parts. The positions of the via electrode parts of the first resonator of the plurality of resonators, and the positions of the via electrode parts of the second resonator, which is adjacent to the first resonator, are mutually offset in a first direction (X), which is the longitudinal direction of the first strip line.

A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other.

A composite electronic component includes a multilayered body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked, a first resonant circuit including a first line and a first capacitor, the first line being formed of one or more first conductor layers of the conductor layers, the first capacitor including a first electrode formed of a plurality of second conductor layers of the conductor layers, and a second resonant circuit including a second line and a second capacitor, the second line being formed of one or more third conductor layers of the conductor layers, the second capacitor including a second electrode formed of the second conductor layers, the second conductor layers being located between the one or more first conductor layers and the one or more third conductor layers.

A package for a tunable filter is disclosed. In an embodiment, the tunable filter includes a substrate having a first interconnection plane and a semiconductor device assembled on the substrate in a first component plane, the semiconductor device electrically connected to the first interconnection plane and containing tunable passive components. The filter further includes a control unit arranged in the first component plane, a dielectric layer arranged above the first component plane, a second component plane arranged on the dielectric layer and discrete passive devices arranged in the second component plane and interconnected with the semiconductor device, wherein the tunable passive components are tunable by the control unit.

A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.

There is disclosed a multi-band reconfigurable antenna device having at least one radiating element. The radiating element is connected to a single port by way of at least first and second matching circuits arranged in parallel. A high pass filter is provided between the first matching circuit and the radiating element so as to allow passage of a first, higher frequency RF signal through the first matching circuit. A low pass filter is provided between the second matching circuit and the at least one radiating element so as to allow passage of a second, lower frequency RF signal through the second matching circuit. The high pass filter blocks passage of the second, lower frequency RF signal through the first matching circuit, and the low pass filter blocks passage of the first, higher frequency RF signal through the second matching circuit. The first and second matching circuits are adjustable independently of each other so as to allow the first and second RF signals to be tuned independently of each other.

A free-from radio frequency (RF) media includes a substrate having a first dielectric layer formed thereon and a second dielectric layer on an upper surface of the first dielectric layer. A first conductive layer is formed on an upper surface of the first dielectric layer and has a first overall profile. A second conductive layer having a second overall profile is formed on an upper surface of the second dielectric layer such that the second dielectric layer is interposed between the first and second conductive layers. The first overall profile of the first conductive layer is different from the second overall profile of the second conductive layer.