The invention relates to a three-dimensional LC electrical resonator device having a given resonant frequency of 100 gigahertz or more, comprising: a separating layer; a first track made of a conductor and comprising two overlapping portions; and a second track made of a conductor, the second track comprising two overlapping portions and an inductive loop connecting the two overlapping portions, the first track and the second track respectively being formed on either side of the separating layer, each overlapping portion of the first track being placed facing a respective overlapping portion of the second track so as to form two capacitors that are spatially spaced apart from each other.

Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate can be laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack can provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces can also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVA) version can provide flipped RF and microwave filters.

Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate are laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVATM) version provides flipped RF and microwave filters.

A filter is disposed on a base board. The filter includes a first portion, a second portion, a ground portion, a first coupling portion and a second coupling portion. The first portion is disposed on a first layer in the base board to input signals. The second portion is disposed on the first layer to output signals. The ground portion is disposed on a second layer in the base board. The first coupling portion is disposed on the first layer. The first coupling portion is electrically coupled to the first portion and the second portion. The first coupling portion is electrically coupled to the ground portion through via holes. The second coupling portion is disposed on the first layer. The second coupling portion is electrically coupled to the first portion and the second portion. The second coupling portion is electrically coupled to the ground portion through the via holes.

The invention relates to a three-dimensional LC electrical resonator device having a given resonant frequency of 100 gigahertz or more, comprising: a separating layer; a first track made of a conductor and comprising two overlapping portions; and a second track made of a conductor, the second track comprising two overlapping portions and an inductive loop connecting the two overlapping portions, the first track and the second track respectively being formed on either side of the separating layer, each overlapping portion of the first track being placed facing a respective overlapping portion of the second track so as to form two capacitors that are spatially spaced apart from each other.

A tunable dual-band resonator and a tunable dual-band band-pass filter using the tunable dual-band resonator. The dual-band resonator is structured such that a stub is added to each half-wavelength resonator provided with half-wavelength resonator protrusions (capacity-component adjust parts). The dual-band resonator is made up of an odd-number mode resonator in a shape including a ground conductor disposed on the back surface of a dielectric body, and a strip conductor disposed on the top surface thereof, and an even-number mode resonator in such a shape as to be formed when the stub is connected to an end face on the opposite side of the open-end of the strip, characterized in that a dielectric rod having a circular cross section is provided in the space above the respective stubs and another dielectric rod having a circular cross section is provided in the space above the half-wavelength resonator protrusions.

A tunable dual-band resonator and a tunable dual-band band-pass filter using the tunable dual-band resonator. The dual-band resonator is structured such that a stub is added to each half-wavelength resonator provided with half-wavelength resonator protrusions (capacity-component adjust parts). The dual-band resonator is made up of an odd-number mode resonator in a shape including a ground conductor disposed on the back surface of a dielectric body, and a strip conductor disposed on the top surface thereof, and an even-number mode resonator in such a shape as to be formed when the stub is connected to an end face on the opposite side of the open-end of the strip, characterized in that a dielectric rod having a circular cross section is provided in the space above the respective stubs and another dielectric rod having a circular cross section is provided in the space above the half-wavelength resonator protrusions.

Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate can be laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack can provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces can also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVA) version can provide flipped RF and microwave filters.

Disclosed herein is a microstrip line filter including a dielectric substrate, a first hairpin resonator, and a metal ground layer. The first hairpin resonator is disposed on a first layer of the dielectric substrate. The metal ground layer is disposed on a second layer of the dielectric substrate. The metal ground layer includes a first defected ground structure. The first defected ground structure includes a first defected area, a second defected area, and a third defected area. The projection of the first defected area on the first layer is located inside the hairpin structure of the first hairpin resonator. The projection of the second defected area on the first layer is located in a direction opposite to an opening direction of the first hairpin resonator. The third defected area connects the first defected area and the second defected area.

A filter includes first and second resonators and first and second stub resonators. Each of the first and second resonators includes a first conductor part and a second conductor part electrically connected to the first conductor part and having an impedance smaller than an impedance of the first conductor part. The first stub resonator is electrically connected to the first conductor part of the first resonator. The second stub resonator is electrically connected to the first conductor part of the second resonator. The shape of the first stub resonator and the shape of the second stub resonator are different from each other.