A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.

Methods directed to finding algorithms designed to estimate the angle of arrival of signals incoming to a communication device by using a modal antenna having multiple radiation patterns are provided. In particular, a method can include obtaining a gain variation between adjacent modes of a plurality of antenna modes at each of a plurality of angles. The method can include obtaining a signal strength variation between the adjacent modes at each of the plurality of angles. The method can include determining a difference value based, at least in part, on the gain variation and the signal strength variation. The method can include determining an angle of arrival of the signal based, at least in part, on the difference value.

The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same. The reconstituted substrates described herein may be utilized to fabricate homogeneous or heterogeneous high-density 3D integrated devices. In one embodiment, a silicon substrate is structured by direct laser patterning to include one or more cavities and one or more vias. One or more semiconductor dies of the same or different types may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. One or more conductive interconnections are formed in the vias and may have contact points redistributed to desired surfaces of the reconstituted substrate. The reconstituted substrate may thereafter be integrated into a stacked 3D device.

A antenna may include a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; an adhesive layer disposed between the second surface and the third surface and connecting the first dielectric layer to the second dielectric layer; a patch pattern disposed on the second surface and embedded in the adhesive layer; and a coupling pattern disposed on the fourth surface and having at least a portion overlapping the patch pattern on a plane. Each of the first dielectric layer and the second dielectric layer may include an organic binder and an inorganic filler.

An electronic device includes a casing, a first antenna assembly, a second antenna assembly and a third antenna assembly. At least one of the first antenna assembly, the second antenna assembly and the third antenna assembly is rotatably disposed on the casing, and the rest are fixed on the casing.

A device includes a device cover and an antenna system underneath the device cover. The device cover is separated from the antenna system. The device cover includes a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system.

An antenna package according to an embodiment includes a plurality of antenna units including first antenna units and second antenna units, a circuit board electrically connected to the antenna units. The circuit board includes a core layer including a first surface and a second surface facing each other, a first circuit wiring disposed on the first surface of the core layer and electrically connected to the first antenna units, and a second circuit wiring distributed on the first and second surfaces of the core layer and electrically connected to the second antenna units. Antenna units of different resonance frequencies can be efficiently included in the package using the circuit wiring design.

An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.

An antenna device includes a ground plane, a first feed via and a second feed via for penetrating the ground plane through a first hole and a second hole of the ground plane, a first feed pattern connected to the first feed via, a first antenna pattern configured to be coupled to the first feed pattern and transmit/receive an RF signal of a first frequency bandwidth, a second antenna pattern connected to the second feed via and configured to transmit/receive an RF signal of a second frequency bandwidth, and a third antenna pattern disposed between the first antenna pattern and the second antenna pattern, and overlapping the first antenna pattern and the second antenna pattern.

An electronic device is provided. The electronic device includes a hinge module, a first housing at least partially coupled to a first side of the hinge module and including a first antenna, a second housing at least partially coupled to a second side of the hinge module, configured to be foldable and unfoldable with the first housing by using the hinge module, and including a second antenna, a sensor circuit configured to detect an unfolding state and/or a folding state of the first housing and the second housing, a processor operatively connected to the first antenna, the second antenna, and the sensor circuit, a first signal line configured to connect the processor and the first antenna, a tuner circuit disposed on the first signal line, and a second signal line configured to connect the processor and the second antenna, wherein the processor is configured to, in case that the first housing and the second housing are detected to be in the folding state by using the sensor circuit, receive feedback of a signal transmitted to the second antenna, detect a phase of the feedback signal, and determine a time constant of the tuner circuit disposed on the first signal line, based on the detected phase of the signal.