Patent classifications
H05K7/20481
Heat Transfer Assembly
A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.
Antenna assembly for a vehicle
A heat dissipation system for an antenna assembly for a vehicle is disclosed that provides enhanced heat removal attributes and that provides heat transfer from various components to a heat sink through different heat transfer flow paths to reduce the transfer of heat from high heat producing components to heat sensitive components. Improved heat insulation components can be added to maximize the thermal isolation between heat producing components and to prevent heat transferred from the vehicle into the antenna assembly.
Electrical connection apparatus
The present disclosure provides an electrical connection apparatus which includes a receptacle and a plug. The receptacle includes a cage, a heat sink, a thermal interface material layer, and an elastic sheathing member. The heat sink is provided to the cage and has a base portion. The base portion has a lower surface, a first side edge close to the port, and a second side edge spaced apart from the first side edge. The heat sink further has two first convex portions positioned on the lower surface and adjacent to the first side edge and a first concave portion positioned on the lower surface and adjacent to the second side edge. The thermal interface material layer is provided to the lower surface of the base portion. The elastic sheathing member sheathes the heat sink and the cage. The plug includes a second convex portion positioned on an upper surface.
THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING SAME
The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.
Cooler and cooler body
The invention relates to a cooler or cooler body which in particular is adapted for cooling electronic structural units or assemblies.
Flexible Graphite Sheet Support Structure and Thermal Management Arrangement
A flexible graphite sheet support structure forms a thermal management arrangement for device having a heat source. The flexible graphite sheet support structure includes first and second spaced apart support members and a flexible graphite sheet secured to the spaced apart support members forming a free standing flex accommodating section that spans between them. Curve retention members having convex curved surfaces are used to keep the flex accommodating section in a bell shaped curve while preventing the flexible graphite sheet from exceeding a minimum bend radius. The thermal management arrangement formed by the flexible graphite sheet support structure enables the flexible graphite sheet to move heat from one support structure to the other while reducing the transmission of vibration between them and allowing relative movement between the spaced apart support structures.
CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING AND USING THEREOF
Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation
A structure having a metal material for heat radiation that is capable of favorably radiating heat from a heat generating component is provided. A structure having a metal material for heat radiation, comprising a heat generating component, a heat generating component protective member that is provided to cover a part or the entire of the heat generating component and to be spaced from the heat generating component, and a heat radiating member that is provided on a face of the heat generating component protective member on the side of the heat generating component to be spaced from a surface of the heat generating component on the side of the heat generating component protective member, wherein the heat radiating member contains a metal material for heat radiation at least on a surface of the heat radiating member on the side of the heat generating component.
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE ADOPTING THE SAME
A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.
HEAD-MOUNTED DISPLAY AND GRIPPING APPARATUS
A head-mounted display configured to display an image to a user includes a protruding member disposed on an outer surface member of the head-mounted display, and in proximity to a heat generation source arranged inside the head-mounted display, and a heat transfer member disposed between the protruding member and the heat generation source, and arranged to be deformable along a shape of the protruding member. Therefore, the present invention is directed to providing a head-mounted display or a gripping apparatus capable of preventing the occurrence of thermal concentration without impairing an observer's feeling of use.