A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the semiconductor wafer. A trench is formed partially through the first surface of the semiconductor wafer. An insulating material is disposed over the first surface of the semiconductor wafer and into the trench. A conductive layer is formed over the contact pads. The conductive layer can be printed to extend over the insulating material in the trench between adjacent contact pads. A portion of the semiconductor wafer opposite the first surface of the semiconductor wafer is removed to the insulating material in the trench. An insulating layer is formed over a second surface of the semiconductor wafer and side surfaces of the semiconductor wafer. The semiconductor wafer is singulated through the insulating material in the first trench to separate the semiconductor die.

The present disclosure relates to a display panel, a display device and a manufacturing method of a display panel. The display panel includes: a display substrate having a display area and a non-display area, the display substrate including a substrate and an IC bonding portion which includes: a pin; a first passivation layer located on one side of the substrate adjacent to the pin and covering a peripheral area of the pin, and exposing a central area of the pin; a first barrier layer located on one side of the first passivation layer away from the substrate and covered at the first passivation layer and an edge of the first passivation layer connected to the pin; and a first metal layer located on one side of the first barrier layer away from the substrate, at least covering a central portion of the pin, and electrically connected to the pin.

A bonded assembly includes a first semiconductor die containing a first substrate, first semiconductor devices, and first bonding pads laterally surrounded by a first pad-level dielectric layer. The first pad-level dielectric layer includes at least one first encapsulated airgap located between neighboring pairs of first bonding pads and encapsulated by a first dielectric fill material of the first pad-level dielectric layer. The bonded assembly includes a second semiconductor die containing a second substrate, second semiconductor devices, and second bonding pads laterally surrounded by a second pad-level dielectric layer. Each of the second bonding pads is bonded to a respective one of the first bonding pads.

A semiconductor structure includes: a first substrate, with a first opening being provided on a surface of first substrate; and a first bonding structure positioned in the first opening. The first bonding structure includes a first metal layer and a second metal layer with a melting point lower than that of the first metal layer. The first metal layer includes a first surface in contact with a bottom surface of the first opening and a second surface opposite to the first surface, the second surface is provided with a first groove, an area, not occupied by the first metal layer and the first groove, of the first opening constitutes a second groove, the second metal layer is formed in the first groove and the second groove, and a surface, exposed from the second groove, of the second metal layer constitutes a bonding surface of the first bonding structure.

An integrated electronic device including: a main body delimited by a front surface; a top conductive region extending within the main body, starting from the front surface; a first dielectric region extending on the front surface; and a barrier structure, arranged on the first dielectric region. A first aperture extends through the barrier structure and the first dielectric region; the first aperture is delimited at bottom by the top conductive region. The integrated electronic device further includes a contact structure including at least a first conductive region extending within the first aperture, in direct contact with the top conductive region and the barrier structure.

A display device includes a first substrate having a display area and a peripheral area, the first substrate including a first inclined surface disposed at an outer portion of the peripheral area and being angled relative to the first substrate in the display area; a pixel structure disposed on the first substrate in the display area; a second substrate disposed on the pixel structure; a first electrode disposed on the first inclined surface and between the first substrate and the second substrate; and a second electrode disposed on sides of the first and second substrates, the second electrode being in contact with the first electrode.

A display device includes a plate-like substrate having a first surface and a second surface, pixel units on the first surface, and a power supply voltage feeder on the second surface. The power supply voltage feeder outputs first and second power supply voltages applicable to the pixel units. The second power supply voltage is lower in potential than the first power supply voltage. The display device includes a first wiring conductor electrically connecting the power supply voltage feeder and the pixel units and a second wiring conductor electrically connecting the power supply voltage feeder and the pixel units. At least one of the first or second wiring conductor includes a planar conductive portion covering the first surface. The planar conductive portion includes connectors connected to the power supply voltage feeder on at least two sides of the substrate.

A display device includes an array substrate, a plurality of mounting electrodes provided to the array substrate, a columnar conductor for coupling provided to each of the mounting electrodes, a plurality of light-emitting elements provided to the array substrate, a first electrode and a second electrode provided to a surface of each of the light-emitting elements facing the array substrate, the first electrode being coupled to one of an anode and a cathode of the light-emitting element, the second electrode being coupled to the other of the anode and the cathode of the light-emitting element, and a coupling member covering each of the first electrode and the second electrode. The columnar conductor is made of material harder than the coupling member, and an end of the columnar conductor on the light-emitting element side is electrically coupled to the coupling member.

A display device includes a driving member which provides an electrical signal and includes a connection terminal which transmits the electrical signal, a pad electrode which receives the electrical signal from the driving member and is electrically connected to the connection terminal of the driving member, an organic layer on the pad electrode, the organic layer including a side surface defining an opening of the organic layer which exposes the pad electrode to outside the organic layer and within the opening, a protrusion protruding from the side surface, and a connection conductive layer which electrically connects the pad electrode to the connection terminal, within the opening of the organic layer, where the connection conductive layer covers each of the pad electrode which is exposed by the opening of the organic layer, the side surface of the organic layer, and the protrusion of the organic layer.

A display panel includes a substrate including a display area and a pad area spaced apart from the display area, and an uneven pad disposed on the substrate in the pad area. The uneven pad includes a first conductive layer, a first organic layer disposed on the first conductive layer and having an upper surface having an uneven shape, and a second conductive layer disposed on the first organic layer.