Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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H01L2224/28
Structure, shape, material or disposition of the layer connectors prior to the connecting process
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H01L2224/29
of an individual layer connector
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H01L2224/2969
with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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H01L2224/2969

CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE CHIP BONDING FILM
20250096184 · 2025-03-20 · ·

A chip bonding film is provided and includes an adhesive film layer that is curable by heat, and fillers that are thermally conductive and are contained in the adhesive film layer, each of the fillers including magnetic particles, wherein a heat dissipation path is formed by the fillers in a vertical direction from a lower surface to an upper surface of the adhesive film layer.

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
20170012022 · 2017-01-12 · ·

There are provided a photosensitive resin composition having excellent heat resistance, developability, and curability, a laminate obtained by using a photosensitive resin composition, a method for manufacturing a semiconductor device, and a semiconductor device.

The photosensitive resin composition includes a polymer including a repeating unit derived from an acid group-containing maleimide, a crosslinking agent, a photopolymerization initiator, and a thermal polymerization initiator. The polymer preferably further includes a repeating unit derived from a vinyl compound.