An integrated circuit (IC) combines a first IC chip (die) having a first on-chip interconnect structure and a second IC chip having a second on-chip interconnect structure on a reconstructed wafer base. The second IC chip is edge-bonded to the first IC chip with oxide-to-oxide edge bonding. A chip-to-chip interconnect structure electrically couples the first IC chip and the second IC chip.

Vertically oriented component stacks, assemblies, and methods are provided. For example, a vertically oriented component stack includes a plurality of components that each include a first side surface opposite a second side surface along a vertical direction. The first and second side surfaces each extend along a longitudinal direction from a first end surface to a second end surface. Each component has a first external termination and a second external termination formed on the first side surface. The first external termination is spaced apart from the second external termination along the longitudinal direction. The plurality of components are stacked along the lateral direction such that the first external terminations of the plurality of components are generally aligned with one another along the lateral direction and the second external terminations of the plurality of components are generally aligned with one another along the lateral direction.

A method for producing a light emitting device includes a first bonding step including disposing a first bonding member a mounting substrate, placing a light emitting element on the mounting substrate such that the first bonding member is located between a mounting face of the light emitting element and the mounting substrate, and hardening the first bonding member thereby bonding the light emitting element and the mounting substrate such that, in a plan view, an entirety of the first bonding member is contained within an area of the mounting face of the light emitting element; and a second bonding step including disposing a second bonding member on the upper face of the mounting substrate such that, in a plan view, the second bonding member is located at at least a portion of an outer edge of the mounting face of the light emitting element, and hardening the second bonding member.