A sensor packaging method and a sensor package are provided. The method includes: providing a substrate having upper and lower board surfaces, in which the upper board surface has a die-bonding region. The substrate includes a core material layer, an upper metal layer, and an upper protection layer, a first window is formed to penetrate the upper protection layer and located at a periphery of the die-bonding region, and the first window is opened for a first ground electrode connected to a first ground portion. The method further includes: performing a dispensing step to apply an adhesive material on the upper board surface in at least a portion of the die-bonding region; and attaching a sensor die to the substrate through the adhesive material, in which the sensor die is disposed in the die-bonding region and has a first ground pin electrically connected to the first ground electrode.