Structures and formation methods of a chip package structure are provided. The chip package structure includes a substrate having die regions separated by a gap region. The gap region includes first and second line regions extending in a first direction. The chip package structure also includes first and second line-shaped insulating layers formed over the substrate in the first and second line regions, respectively. The chip package structure further includes insulating layers formed over the substrate. Two of the insulating layers are adjacent to two opposing ends of the first line-shaped insulating layer, respectively, and made of a different material than the first line-shaped insulating layer.

Provided is a curable composition for forming an adhesive structure that can be discharged by an inkjet printing method and includes a glycidylamine-type epoxy compound, an oxetane compound, and a cationic polymerization initiator. In the curable composition for forming an adhesive structure, a proportion of the glycidylamine-type epoxy compound is 10% by mass or more.

A package structure is provided. The package structure includes a chip structure and a first adhesive element partially covering the chip structure. The first adhesive element has a first portion and a second portion, and the first portion is spaced apart from the second portion. The first adhesive element has a first thermal conductivity. The package structure also includes a second adhesive element partially covering the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is higher than the first thermal conductivity.