A semiconductor package includes a substrate having first and second surfaces, first and second pads disposed on the first and second surfaces respectively and electrically connected to each other, a semiconductor chip disposed on the first surface and connected to the first pads, a dummy chip disposed on the first surface, the dummy chip having an upper surface positioned lower than an upper surface of the semiconductor chip in a direction perpendicular to the first surface of the substrate, an underfill between the semiconductor chip and the first surface of the substrate with an extension portion extended along facing side surfaces of the semiconductor chip and the dummy chip in the perpendicular direction, an upper end of the extension portion lower than the upper surface of the semiconductor chip, and a sealing material on the first surface to seal the semiconductor chip and the dummy chip.

A semiconductor package includes a substrate having first and second surfaces, first and second pads disposed on the first and second surfaces respectively and electrically connected to each other, a semiconductor chip disposed on the first surface and connected to the first pads, a dummy chip disposed on the first surface, the dummy chip having an upper surface positioned lower than an upper surface of the semiconductor chip in a direction perpendicular to the first surface of the substrate, an underfill between the semiconductor chip and the first surface of the substrate with an extension portion extended along facing side surfaces of the semiconductor chip and the dummy chip in the perpendicular direction, an upper end of the extension portion lower than the upper surface of the semiconductor chip, and a sealing material on the first surface to seal the semiconductor chip and the dummy chip.

A multi-chip package structure includes a chip interconnect bridge, a fan-out redistribution layer structure, a first integrated circuit chip, and a second integrated circuit chip. The chip interconnect bridge includes contact pads disposed on a top-side of the chip interconnect bridge. The fan-out redistribution layer structure is disposed around sidewalls of the chip interconnect bridge and over the top-side of the chip interconnect bridge. The first and second integrated circuit chips are direct chip attached to an upper surface of the fan-out redistribution layer structure, wherein the fan-out redistribution layer structure includes input/output connections between the contact pads on the top-side of the chip interconnect bridge and the first and second integrated circuit chips.

An interconnection layer carrying structure for transferring an interconnection layer onto a substrate is disclosed. The interconnection layer carrying structure includes a support substrate, a release layer on the support substrate; and an interconnection layer on the release layer. The interconnection layer includes an organic insulating material and a set of pads embedded in the organic insulating material. The set of the pads is configured to face towards the support substrate. The support substrate has a base part where the interconnection layer is formed and an extended part extending outside the base part.

A multi-chip package structure includes a chip interconnect bridge, a fan-out redistribution layer structure, a first integrated circuit chip, and a second integrated circuit chip. The chip interconnect bridge includes contact pads disposed on a top side of the chip interconnect bridge. The fan-out redistribution layer structure is disposed around sidewalls of the chip interconnect bridge and over the top side of the chip interconnect bridge. The first and second integrated circuit chips are direct chip attached to an upper surface of the fan-out redistribution layer structure, wherein the fan-out redistribution layer structure includes input/output connections between the contact pads on the top side of the chip interconnect bridge and the first and second integrated circuit chips.

A multi-chip package structure includes a chip interconnect bridge, a fan-out redistribution layer structure, a first integrated circuit chip, and a second integrated circuit chip. The chip interconnect bridge includes contact pads disposed on a top-side of the chip interconnect bridge. The fan-out redistribution layer structure is disposed around sidewalls of the chip interconnect bridge and over the top-side of the chip interconnect bridge. The first and second integrated circuit chips are direct chip attached to an upper surface of the fan-out redistribution layer structure, wherein the fan-out redistribution layer structure includes input/output connections between the contact pads on the top-side of the chip interconnect bridge and the first and second integrated circuit chips.

One of semiconductor packages includes a substrate and a package structure. The package structure is bonded to the substrate and includes a first redistribution layer structure, a first logic die, a plurality of second logic dies, a first memory die, a first heat conduction block and a first encapsulant. The first logic die and the second logic dies are disposed over and electrically connected to the first redistribution layer structure. The first memory die is disposed over the first logic die and the second logic dies and electrically connected to first redistribution layer structure. The first heat conduction block is disposed over the first logic die and the second logic dies. The first encapsulant encapsulates the first memory die and the first heat conduction block.

A semiconductor package includes a semiconductor substrate forming a cavity and a redistribution layer on a first side of the semiconductor substrate, the redistribution layer forming die contacts within the cavity and a set of terminals for the semiconductor package opposite the semiconductor substrate. The redistribution layer electrically connects one or more of the die contacts to the set of terminals. The semiconductor package further includes a semiconductor die including die terminals within the cavity with the die terminals electrically coupled to the die contacts within the cavity.

Provided is a light emitting element according to embodiments which includes a body including a semiconductor layer and an active layer, and a ligand including a head portion bonded to a surface of the body, an end portion spaced apart from the body, and having a positive or a negative charge, and a chain portion connecting the head portion and the end portion.

Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.