An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.

A light-emitting device includes: a light-emitting element; a coating member that covers the light-emitting element; and two external connection electrodes exposed form a first surface of the coating member. Each of the external connection electrodes includes an electrode buried in the coating member; and a metal layer formed on the electrode. A surface of each of the metal layers is exposed from the first surface of the coating member. The first surface of the coating member includes a plurality of grooves between the external connection electrodes.

An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.

A light-emitting device includes: a light-emitting element; a coating member that covers the light-emitting element; and two external connection electrodes exposed form a first surface of the coating member. Each of the external connection electrodes includes an electrode buried in the coating member; and a metal layer formed on the electrode. A surface of each of the metal layers is exposed from the first surface of the coating member. The first surface of the coating member includes a plurality of grooves between the external connection electrodes.

A package structure is provided. The package structure includes a chip-containing structure over a substrate and a first adhesive element directly above the chip-containing structure. The first adhesive element has a first thermal conductivity. The package structure also includes multiple second adhesive elements directly above the chip-containing structure. The second adhesive elements are spaced apart from each other, each of the second adhesive elements has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The package structure further includes a protective lid attached to the chip-containing structure through the first adhesive element and the second adhesive elements. The protective lid extends across opposite sidewalls of the chip-containing structure.

A printed substrate having a first surface to which an electronic component is to be fixed through an underfill material includes a groove that is recessed from the first surface. The first surface includes a pair of lands that is to be electrically connected to the electronic component. The groove extends in a first direction in which the pair of lands extends and is located in a facing region of the first surface in which the first surface is to face the electronic component. An electronic device includes the printed substrate, the electronic component fixed to the first surface and the underfill material disposed between the first surface and the electronic component.

A light-emitting device includes: a light-emitting element; a coating member that covers the light-emitting element; and two external connection electrodes exposed form a first surface of the coating member. Each of the external connection electrodes includes an electrode buried in the coating member; and a metal layer formed on the electrode. A surface of each of the metal layers is exposed from the first surface of the coating member. The first surface of the coating member includes a plurality of grooves between the external connection electrodes.

A metal coating method includes forming a metal layer on a substrate including a first member and a second member, the second member having a lower thermal conductivity than a thermal conductivity of the first member, and irradiating the metal layer formed on the first member and the second member with a laser beam such that, after irradiation, the metal layer formed on the first member remains, and the metal layer formed on the second member is removed.

The semiconductor device includes first and second semiconductor elements. Each element has an obverse surface and a reverse surface, with a first electrode arranged on the reverse surface, and with a second electrode arranged on the obverse surface. The semiconductor device further includes: a first lead having an obverse surface and a reverse surface; an insulating layer covering the first lead, the first semiconductor element and the second semiconductor element; a first electrode connected to the second electrode of the first semiconductor element; and a second electrode connected to the first lead. The first semiconductor element and the first lead are bonded to each other with the reverse surface of the first semiconductor element facing the lead obverse surface. The second semiconductor element and the first lead are bonded to each other with the reverse surface of the second semiconductor element facing the lead reverse surface.

A package structure includes an encapsulant, an active component, a first lead frame segment, and a second lead frame segment. The active component is encapsulated within the encapsulant and includes first and second electrodes. The first and second electrodes are respectively disposed on and electrically connected to the first and second lead frame segments. The first and second lead frame segments respectively have first and second exposed surfaces. The first exposed surface and the first electrode are respectively located on opposite sides of the first lead frame segment. The second exposed surface and the second electrode are respectively located on opposite sides of the second lead frame segment. The first and second exposed surfaces are exposed outside the encapsulant. A minimal distance from the first electrode to the second electrode is less than a minimal distance from the first exposed surface to the second exposed surface.