Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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H01L2224/36
Structure, shape, material or disposition of the strap connectors prior to the connecting process
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H01L2224/37
of an individual strap connector
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H01L2224/37578
being disposed next to each other, e.g. side-to-side arrangements
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H01L2224/37578

SEMICONDUCTOR DEVICE
20240063150 · 2024-02-22 ·

A semiconductor device includes a lead frame, a semiconductor element, a clip, a sealing material, and a thermal resistance portion. The semiconductor element is mounted on the lead frame. The clip is bonded through a bonding material to an electrode on a surface of the semiconductor element opposite to the lead frame. The sealing material covers the semiconductor element and the clip. The thermal resistance portion is disposed in a bonding region bonded through the bonding material between the semiconductor element and the clip. The thermal resistance portion has a thermal resistance higher than that of a different portion in the bonding region.