An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.

In described examples, a method for fabricating a semiconductor device and a three dimensional structure, and packaging them together, includes: fabricating the integrated circuit on a substrate, immersing the substrate in a liquid encapsulation material, and illuminating the liquid encapsulation material to polymerize the liquid encapsulation material. Immersing the semiconductor device is performed to cover a layer of a platform in the liquid encapsulation material. The platform is a lead frame, a packaging substrate, or the substrate. The illuminating step targets locations of the liquid encapsulation material covering the layer. Illuminated encapsulation material forms solid encapsulation material that is fixedly coupled to contiguous portions of the semiconductor device and of the solid encapsulation material. The immersing and illuminating steps are repeated until a three dimensional structure is formed. The integrated circuit and the three dimensional structure are encapsulated in a single package.

An LED light bulb includes a bulb shell, a bulb base, a stem, conductive supports, an LED filament, and a supporting arm. The bulb base is connected to the bulb shell. The stem is connected to the bulb base. The conductive supports are connected to the stem. The LED filament includes a filament body and two conductive electrodes. The conductive electrodes are at two ends of the filament body and connected to the conductive supports. The filament body is around the stem. The supporting arm is connected to the stem and the filament body. In a height direction of the LED light bulb, H is a distance from a bottom to a top of the bulb shell. A first height difference is defined between the two conductive electrodes and is from 0 to 1/10H. The filament body is curved to form a highest point and a lowest point. A second height difference is defined between the highest point and the lowest point. The first height difference is less than the second height difference.

An implantable device is provided that can include any number of features. In some embodiments, the device includes a coil antenna configured to receive wireless power from a power source external to the patient. The device can include at least one sensor configured to sense a bodily parameter of the patient. The device can also include electronics configured to communicate the sensed bodily parameter of to a device located external to the patient. Methods of use are also described.

In described examples, a method for fabricating a semiconductor device and a three dimensional structure, and packaging them together, includes: fabricating the integrated circuit on a substrate, immersing the substrate in a liquid encapsulation material, and illuminating the liquid encapsulation material to polymerize the liquid encapsulation material. Immersing the semiconductor device is performed to cover a layer of a platform in the liquid encapsulation material. The platform is a lead frame, a packaging substrate, or the substrate. The illuminating step targets locations of the liquid encapsulation material covering the layer. Illuminated encapsulation material forms solid encapsulation material that is fixedly coupled to contiguous portions of the semiconductor device and of the solid encapsulation material. The immersing and illuminating steps are repeated until a three dimensional structure is formed. The integrated circuit and the three dimensional structure are encapsulated in a single package.

An LED light bulb includes a bulb shell, a bulb base, a stem, conductive supports, an LED filament, and a supporting arm. The bulb base is connected to the bulb shell. The stem is connected to the bulb base. The conductive supports are connected to the stem. The LED filament includes a filament body and two conductive electrodes. The conductive electrodes are at two ends of the filament body and connected to the conductive supports. The filament body is around the stem. The supporting arm is connected to the stem and the filament body. In a height direction of the LED light bulb, H is a distance from a bottom to a top of the bulb shell. A first height difference is defined between the two conductive electrodes and is from 0 to 1/10H. The filament body is curved to form a highest point and a lowest point. A second height difference is defined between the highest point and the lowest point. The first height difference is less than the second height difference.

A semiconductor chip includes a substrate including a circuit area having a rectangular shape and a peripheral area surrounding the circuit area, a key area being overlapping a part of the circuit area and a part of the peripheral area, a plurality of drive circuit cells in the circuit area, and a conductive reference line on the peripheral area and extending in a first direction parallel to a first edge among four edges of the rectangular shape of the circuit area.

An implantable device is provided that can include any number of features. In some embodiments, the device includes a coil antenna configured to receive wireless power from a power source external to the patient. The device can include at least one sensor configured to sense a bodily parameter of the patient. The device can also include electronics configured to communicate the sensed bodily parameter of to a device located external to the patient. Methods of use are also described.

A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.

An LED filament, comprising: an enclosure; a linear array of LED devices; and an electrical connector, wherein: the enclosure includes an optically transmissive binder; and the linear of LED devices is conformally wrapped around by the enclosure to be operable to emit light when energized through the electrical connector.