The present invention provides a polyamide composition for a reflector having high heat resistance and good mechanical properties, having excellent adhesion to a sealing material for an LED package, and capable of retaining a high reflectance even after exposure to heat and light intended for the production process of the LED package and the environment in which the reflector is used in the LED package, when it is molded. The present invention is a polyamide composition for a reflector, containing: 30 mass % or more of a polyamide (A) having a melting point of 280° C. or higher; and 25 mass % or more of titanium oxide (B). The total content of the polyamide (A) and the titanium oxide (B) is 75 mass % or more.

A lighting apparatus includes a fixture having a fastening hole, the fastening hole including a first portion and a second portion connected to each other, and the second portion having a width smaller than a diameter of the first portion, a light source module having a fastening pin detachably fastened to the fastening hole, and an electrode terminal on the fixture and connected to the light source module, wherein the light source module is slidably moveable along a surface of the fixture, as the fastening pin is moveable within the fastening hole from the first portion to the second portion.

A laser diode chip includes a removable substrate, a first semiconductor layer disposed on the removable substrate, an emitting layer disposed on one part of the first semiconductor layer, a second semiconductor layer disposed on the emitting layer and forming a ridge mesa, a current conducting layer disposed on another part of the first semiconductor layer, a patterned insulating layer covering the second semiconductor layer and the current conducting layer and including a first zone and a second zone which respectively expose a part of the current conducting layer and a part of the second semiconductor layer, a first electrode and a second electrode respectively disposed on the first zone and the second zone. A projection of the ridge mesa projected to the removable substrate covers a part of projections of the first electrode and the second electrode projected to the removable substrate.

An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

An electronic device includes a semiconductor body and a dielectric layer extending over the semiconductor body. A galvanic isolation module includes a first metal region extending in the dielectric layer at a first height and a second metal region extending in the dielectric layer at a second height greater than the first height. The first and second metal regions are capacitively or magnetically coupleable together. The second metal region includes a side wall and a bottom wall coupled to one another through rounded surface portions.

A light-emitting diode (LED) light source includes a plurality of electricity-conducting holding elements, and each electricity-conducting holding element is made of a thin metal sheet. The bendable LED light source increases installation of sufficient number of LED dies by lengthening the length of the LED light source. The LED light source is bent to form a spring-like helical structure and then is placed inside a lamp cover. The helical LED light source is fastened on a T-shaped element by a plurality of fastening elements and the T-shaped element is fixed on an insulated holder. Accordingly, a bulb-type LED lamp is implemented.

A fluorescent type of green light source of a semiconductor in a light source apparatus for an endoscope includes a blue excitation light source device and green emitting phosphor. The blue excitation light source device emits blue excitation light. The green emitting phosphor is excited by the blue excitation light, and emits green fluorescence. A dichroic filter in a dichroic mirror cuts off the blue excitation light from an emission spectrum of mixed light of the blue excitation light and green fluorescence from the fluorescent type of green light source. Thus, illumination light with the emission spectrum of a target can be stably supplied without influence of the blue excitation light to a light amount of blue light from a blue light source of a semiconductor.

An LED module A1 is provided with: a first lead 1 including a die-bonding portion 12 with a mount surface 12a, and a front-end sunk portion 14; a second lead 2 including a wire-bonding portion 22 and spaced apart from the first lead 1; an LED chip 3 mounted on the mount surface 12a and provided with a first electrode terminal 31 and a second electrode terminal 32; a wire 61 connecting the second electrode terminal 32 and the wire-bonding portion 22; and a support member 4 including a protective portion 42 and supporting the leads 1 and 2. The protective portion covers the front-end sunk portion 14 with the mount surface 12a exposed, and includes an inclined portion 42a that becomes thinner as proceeding from the die-bonding portion 12 toward the lead 2.

To provide a semiconductor element that can have the high adhesion between a substrate made of an oxide or the like and a metal film, a semiconductor element includes a substrate made of an oxide, a semiconductor element structure provided on an upper surface of the substrate, and a metal film provided on a lower surface of the substrate, in which the metal film contains nanoparticles made of an oxide.

A semiconductor light emitting device includes a substrate formed of a first material; and a convex portion protruding from the substrate and including: a first layer formed of the first material as that of the substrate; and a second layer formed of a second material different from the first material and disposed on the first layer. A second height of the second layer is greater than a first height of the first layer.