A light emitting device including a package body having a first cavity; an electrode having a first electrode and a second electrode in the package body; at least one light emitting chip on the first electrode; a resin material in the first cavity; and a lens on the package body and the at least one light emitting chip. Further, the first electrode and the second electrode are separated by the package body, the package body comprises a first stepped portion exposed between the first electrode and the second electrode, the first electrode comprises a second cavity, and the at least one light emitting chip is disposed on the second cavity of the first electrode.

Disclosed is a curable resin composition that has significantly high transparency in the UV region, UV resistance and heat resistance, does not cause cracking, peeling or coloration even when used for sealing a UV LED to which high power is applied, and inhibits shrinking during curing. The curable resin composition includes 20-85 wt % of an alkoxy oligomer having a specific structure and present as liquid at room temperature and 15-80 wt % of a silicone resin present as solid at room temperature. The curable resin composition preferably includes 0.1-20 parts by weight of phosphoric acid, as a catalyst, based on 100 parts by weight of the combined weight of the alkoxy oligomer and the silicone resin.

A light emitting device including a substrate including an entire top surface that is flat, a light emitting diode on the substrate, a lead frame disposed on the flat top surface of the substrate, the lead frame electrically connected to the light emitting diode, a dam member disposed on the substrate and being adjacent to the light emitting diode, the dam member having a circular configuration which has an opening, a first member disposed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode, a second member disposed in the opening of the dam member, a circumference of the second member being defined by the dam member and a lens disposed on the second member is provided.

A sensor can comprise a sensor die with a first sensor surface and a second sensor surface opposite to the first sensor surface. The sensor can further comprise a die pad component with a first pad surface and a second pad surface opposite to the first pad surface, wherein the sensor die is vertically stacked with the die pad component, with the second sensor surface oriented toward the first pad surface. The sensor can further comprise a lead frame component with a first frame surface and a second frame surface opposite to the first frame surface, the die pad component is vertically stacked with the lead frame component, wherein the second pad surface is oriented toward the first frame surface, the second pad surface is isolated from the second frame surface, and the lead frame component is electrically connected to the sensor die.

A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.

The present invention relates to a fluorescent material and, more particularly, to an oxynitride fluorescent material, a method for preparing the same, and a light emitting device package using the same. The present invention can provide an oxynitride fluorescent material represented by chemical formula 1 below, wherein the ratio of M to A is 0.950-0.985:2 (M:A=0.950-0.985:2). MA.sub.2N.sub.2O.sub.2:R (in chemical formula 1 above, M is at least one element selected from Mg, Ca, Sr, and Ba; R, as an activator, is one of the rare-earth elements; and A is at least one element selected from Si and Ge).

An LED module according to the present invention includes an LED unit 2 and a case 1, where the LED unit includes an LED chip 21, and the case 1 includes a main body 11 made of a ceramic material and a pad 12a on which the LED unit 2 is mounted. The outer edge 121a of the pad 12a is positioned inward of the outer edge 2a of the LED unit 2 as viewed in plan. These arrangements prevent the light emission amount of the LED module A1 from reducing with time.

A coated phosphor comprises phosphor particles, wherein said phosphor particles comprise manganese-activated complex fluoride phosphors; and a coating on individual ones of said phosphor particles, said coating comprising a layer of carboxylic acid material encapsulating the individual phosphor particles.

Provided are a light source circuit unit that improves light extraction efficiency, as well as an illuminator and a display that include such a light source circuit unit. The light source circuit unit includes: a circuit substrate having a wiring pattern on a surface thereof, the wiring pattern having light reflectivity, a circular pedestal provided on the circuit substrate, a water-repelling region provided at least from a peripheral edge portion of the pedestal to a part of a side face of the pedestal, and one or two or more light-emitting device chips mounted on the pedestal, and driven by a current that flows through the wiring pattern.

A semiconductor light-emitting device including a light-emitting diode chip and an electrode disposed thereon is provided. The electrode at least includes a plated silver alloy (Ag.sub.1-xY.sub.x) layer, wherein the Y of the Ag.sub.1-xY.sub.x layer includes metals forming a complete solid solution with Ag at arbitrary weight percentage, and the X of the Ag.sub.1-xY.sub.x layer is in a range from about 0.02 to 0.15. The fabricating method thereof is also provided.