A semiconductor device includes an insulation substrate including a circuit pattern, semiconductor chips mounted on the circuit pattern, a wire connecting between the semiconductor chips and between the semiconductor chip and the circuit pattern, and a conductive material serving as a conductor formed integrally with the wire.

A semiconductor package includes a lower semiconductor die and an upper semiconductor die which are stacked with an offset in a first direction, wherein the lower semiconductor die includes a plurality of lower pads arranged in a second direction, which is perpendicular to the first direction, and wherein the upper semiconductor die includes a plurality of upper pads arranged in the second direction. The semiconductor package also includes bent wires electrically connecting the lower pads of the lower semiconductor die with the upper pads of the upper semiconductor die in the first direction. The semiconductor package further includes vertical wires such that a vertical wire is disposed on any one of the lower pad and the upper pad for each pair of pads electrically connected by a bent wire.

An integrated circuit package structure includes a circuit board, an integrated circuit die and a conductive stair structure. The circuit has an upper surface. The integrated circuit die is located on the upper surface of the circuit board. The conductive stair structure is located on the upper surface of the circuit board. The conductive stair structure includes steps along a first direction substantially perpendicular to the upper surface of the circuit board. The steps have different heights relative to the upper surface of the circuit board.

A semiconductor package may include a substrate including a first coupling terminal and a second coupling terminal, a first chip disposed on the substrate, the first chip including a first pad and a second pad, and a connection structure connecting the first coupling terminal to the first pad. A portion of the connection structure may be in contact with a first side surface of the first chip. The connection structure may include a connection conductor electrically connecting the first pad to the first coupling terminal.

In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

A quantum computing system that includes a quantum circuit device having at least one operating frequency; a first substrate having a first surface on which the quantum circuit device is disposed; a second substrate having a first surface that defines a recess of the second substrate, the first and second substrates being arranged such that the recess of the second substrate forms an enclosure that houses the quantum circuit device; and an electrically conducting layer that covers at least a portion of the recess of the second substrate.

A multi-chip device is provided. The multi-chip device includes a first chip, a second chip mounted on the first chip, and a hardened printed or sprayed electrically conductive material forming a sintered electrically conductive interface between the first chip and the second chip.

According to one embodiment, a memory system includes: a first package including a first memory chip configured to store data, and a first chip containing a first circuit configured to control an On Die Termination (ODT) operation based on a first signal which is a control signal for reading of data stored in the first memory chip; a second package including a second memory chip configured to store data, and a second chip containing a second circuit configured to control the ODT operation based on the first signal, the first signal also being a control signal for reading of data stored in the second memory chip; and a controller configured to transmit the first signal to the first chip and the second chip.

A semiconductor package includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a first semiconductor chip disposed on the substrate, the first semiconductor chip having a stepped portion, a second semiconductor chip disposed on the substrate and horizontally spaced apart from the first semiconductor chip in the first direction, a third semiconductor chip disposed on the second semiconductor chip and a bottom surface of the stepped portion, and an upper adhesive layer disposed between the second semiconductor chip and the third semiconductor chip, the upper adhesive layer contacting a portion of the bottom surface of the stepped portion.

In one example, a method of manufacturing a semiconductor device includes providing a substrate having substrate terminals and providing a component having a first component terminal and a second component terminal adjacent to a first major side of the component. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first component terminal and a first substrate terminal and coupling the second clip to a second substrate terminal. The method includes encapsulating the component, portions of the substrate, and portions of the clip structure. the method includes removing a sacrificial portion of the clip connector while leaving a first portion of the clip connector attached to the first clip and leaving a second portion of the clip connector attached to the second clip. In some examples, the first portion of the clip connector includes a first portion surface, the second portion of the clip connector includes a second portion surface, and the first portion surface and the second portion surface are exposed from a top side of the encapsulant after the removing. Other examples and related structures are also disclosed herein.