Patent classifications
H
H01
H01L
29/00
H01L29/66
H01L29/68
H01L29/76
H01L29/772
H01L29/778
H01L29/7782
H01L29/7783
H01L29/7784
H01L29/7784
Carbon doping semiconductor devices
A method of fabricating a semiconductor device can include forming a III-N semiconductor layer in a reactor and injecting a hydrocarbon precursor into the reactor, thereby carbon doping the III-N semiconductor layer and causing the III-N semiconductor layer to be insulating or semi-insulating. A semiconductor device can include a substrate and a carbon doped insulating or semi-insulating III-N semiconductor layer on the substrate. The carbon doping density in the III-N semiconductor layer is greater than 510.sup.18 cm.sup.3 and the dislocation density in the III-N semiconductor layer is less than 210.sup.9 cm.sup.2.