H01L29/7784

Carbon doping semiconductor devices

A method of fabricating a semiconductor device can include forming a III-N semiconductor layer in a reactor and injecting a hydrocarbon precursor into the reactor, thereby carbon doping the III-N semiconductor layer and causing the III-N semiconductor layer to be insulating or semi-insulating. A semiconductor device can include a substrate and a carbon doped insulating or semi-insulating III-N semiconductor layer on the substrate. The carbon doping density in the III-N semiconductor layer is greater than 510.sup.18 cm.sup.3 and the dislocation density in the III-N semiconductor layer is less than 210.sup.9 cm.sup.2.