Representative implementations of devices and techniques provide a hybrid interposer for 3D or 2.5D package arrangements. A quantity of pockets is formed on a surface of a carrier in a predetermined pattern. The pockets are filled with a reflowable conductive material. Chip dice are coupled to the interposer carrier by fixing terminals of the dice into the pockets. The carrier may include topside and backside redistribution layers to provide fanout for the chip dice, for coupling the interposer to another carrier, board, etc. having a pitch greater than that of the chip dice.

Representative implementations of devices and techniques provide a hybrid interposer for 3D or 2.5D package arrangements. A quantity of pockets is formed on a surface of a carrier in a predetermined pattern. The pockets are filled with a reflowable conductive material. Chip dice are coupled to the interposer carrier by fixing terminals of the dice into the pockets. The carrier may include topside and backside redistribution layers to provide fanout for the chip dice, for coupling the interposer to another carrier, board, etc. having a pitch greater than that of the chip dice.

Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.

Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.

Methods of forming stacked die assemblies are described. Those methods/structures may include forming a circuit element on a first substrate, wherein a first die is adjacent the circuit element, forming a via disposed directly on a surface of the circuit element, and forming a mold compound on the first die, on the circuit element and on the via, wherein the via and circuit element are completely embedded within the mold compound. A routing layer is formed on a top surface of the mold compound, and a second die is coupled with the routing layer.

Methods of forming stacked die assemblies are described. Those methods/structures may include forming a circuit element on a first substrate, wherein a first die is adjacent the circuit element, forming a via disposed directly on a surface of the circuit element, and forming a mold compound on the first die, on the circuit element and on the via, wherein the via and circuit element are completely embedded within the mold compound. A routing layer is formed on a top surface of the mold compound, and a second die is coupled with the routing layer.

Representative implementations of devices and techniques provide a hybrid interposer for 3D or 2.5D package arrangements. A quantity of pockets is formed on a surface of a carrier in a predetermined pattern. The pockets are filled with a reflowable conductive material. Chip dice are coupled to the interposer carrier by fixing terminals of the dice into the pockets. The carrier may include topside and backside redistribution layers to provide fanout for the chip dice, for coupling the interposer to another carrier, board, etc. having a pitch greater than that of the chip dice.

Representative implementations of devices and techniques provide a hybrid interposer for 3D or 2.5D package arrangements. A quantity of pockets is formed on a surface of a carrier in a predetermined pattern. The pockets are filled with a reflowable conductive material. Chip dice are coupled to the interposer carrier by fixing terminals of the dice into the pockets. The carrier may include topside and backside redistribution layers to provide fanout for the chip dice, for coupling the interposer to another carrier, board, etc. having a pitch greater than that of the chip dice.

A semiconductor device equipped with a base board, a first element, a second element, and an interposer board, wherein: the first element is positioned on the base board; a signal transmitting/receiving terminal of the first element and a plurality of base board terminals contact one another; the second element is positioned on the base board; a signal transmitting/receiving terminal of the second element and the plurality of base board terminals contact one another; the interposer board is positioned so as to extend on the first element and the second element; a first contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal; and a second contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal.

A semiconductor device equipped with a base board, a first element, a second element, and an interposer board, wherein: the first element is positioned on the base board; a signal transmitting/receiving terminal of the first element and a plurality of base board terminals contact one another; the second element is positioned on the base board; a signal transmitting/receiving terminal of the second element and the plurality of base board terminals contact one another; the interposer board is positioned so as to extend on the first element and the second element; a first contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal; and a second contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal.