Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/10
Bump connectors; Manufacturing methods related thereto
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H01L2224/12
Structure, shape, material or disposition of the bump connectors prior to the connecting process
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H01L2224/13552

Semiconductor chip having stepped conductive pillars
12417994 · 2025-09-16 · ·

In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.

Copper pillar bump structure and method of manufacturing the same
12482777 · 2025-11-25 · ·

A copper pillar bump (CPB) structure is provided in the present invention, including a substrate, a pad on the substrate, a passivation layer covering the substrate and exposing the pad, and a copper pillar on the passivation layer and the pad and connecting directly with the pad. The copper pillar is provided with an upper part and a lower part, and a top surface of the lower part includes a first top surface and a second top surface. The second top surface is on one side of the first top surface, and the upper part of the copper pillar is on the first top surface of the lower part. A metal bump is on the copper pillar, wherein parts of the metal bump directly contact the second top surface of the lower part.

ELECTRONIC COMPONENT, HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE
20250372557 · 2025-12-04 · ·

An electronic component includes a substrate and a pillar electrode. The substrate includes a first principal surface. The pillar electrode protrudes from the first principal surface of the substrate in a thickness direction of the substrate. The pillar electrode is positioned between the first principal surface of the substrate and a bump electrode. The pillar electrode includes a second principal surface and a peripheral surface. The second principal surface is in contact with the bump electrode. The peripheral surface is connected to the second principal surface and to the first principal surface of the substrate. The pillar electrode includes a groove disposed at the second principal surface of the pillar electrode. A bottom of the groove is connected to the peripheral surface of the pillar electrode.