Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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H01L2224/28
Structure, shape, material or disposition of the layer connectors prior to the connecting process
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H01L2224/29
of an individual layer connector
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H01L2224/29686
with a principal constituent of the material being a non metallic, non metalloid inorganic material
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H01L2224/29687
Ceramics, e.g. crystalline carbides, nitrides or oxides
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H01L2224/29687

Chemical bonding method and joined structure
12451461 · 2025-10-21 · ·

The present invention achieves chemical bonding by means of a joined film made of oxides formed on a joined surface. In a vacuum container, amorphous oxide thin films are respectively formed on smooth surfaces of two substrates, and the two substrates overlap such that the amorphous oxide thin films formed on the two substrates come into contact with each other, thereby causing chemical bonding involving an atomic diffusion at a joined interface between the amorphous oxide thin films to join the two substrates.

COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING
20250357263 · 2025-11-20 ·

A device package includes a diamond heat spreader and a filler material bonded to a first side of the diamond heat spreader. A first integrated circuit (IC) device coupled to a second side of the diamond heat spreader opposite the filler material. A second IC device wherein a first side of the filler material opposite of a side bonded to the heat spreader shares a horizontal plane with a top side of the second IC device.