A power semiconductor device includes: a substrate in which a positive electrode wiring connected to a first conductor on a high potential side and a negative electrode wiring connected to a fourth conductor on a low potential side are provided on one surface, and an output wiring connected to a second conductor and a third conductor is provided on the other surface so as to face the positive electrode wiring and the negative electrode wiring; and a first capacitor that smooths DC power supplied to a first upper-arm circuit body and a first lower-arm circuit body. The substrate is disposed between the first upper-arm circuit body and the first lower-arm circuit body. The first capacitor is disposed between the first upper-arm circuit body and the first lower-arm circuit body, and is connected to the positive electrode wiring and the negative electrode wiring on the substrate.

An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Integrated circuit (IC) packages for facilitating power converter systems and methods are provided. In one example, an IC package includes a leadframe. The IC package further includes an IC die coupled to the leadframe. The IC die includes a plurality of switches and a control circuit configured to control a state of at least a subset of the plurality of switches. The IC package further includes a plurality of metal clips. The IC package further includes a plurality of multi-layer ceramic capacitors coupled to the IC die via the plurality of metal clips. Each multi-layer ceramic capacitor is coupled to a subset of the plurality of switches via a subset of the plurality of metal clips. The IC package further includes a mold compound to encapsulate the leadframe, the IC die, the metal clips, and the multi-layer ceramic capacitors. Related systems and methods are also provided.