Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface of the packaging substrate, wherein each package layer is formed by subsequently forming a mounting layer, a sealant layer, and a wiring layer. Further, the method includes forming a top sealant layer and planting connection balls on the second functional surface of the packaging substrate.

Semiconductor device packages include first and second semiconductor dice in a facing relationship. At least one group of solder bumps is substantially along a centerline between the semiconductor dice and operably coupled with integrated circuitry of the first and second semiconductor dice. Another group of solder bumps is laterally offset from the centerline and operably coupled only with integrated circuitry of the first semiconductor die. A further group of solder bumps is laterally offset from the centerline and operably coupled only with integrated circuitry of the second semiconductor die. Methods of forming semiconductor device packages include aligning first and second semiconductor dice with active surfaces facing each other, the first and second semiconductor dice each including bond pads along a centerline thereof and additional bond pads laterally offset from the centerline thereof.

A semiconductor storage device of an embodiment includes a substrate, a seal member, a first memory chip, and a non-signal wiring. The non-signal wiring has a wiring main body. The wiring main body includes a first portion, a second portion, a third portion. The first portion extends in a second direction intersecting the first direction. The second portion is folded back from an end of the first portion to a first side in the second direction. The second portion extends parallel to the first portion. The third portion is folded back from an end of the second portion to a second side in the second direction. The second side is a side opposite to the first side in the second direction. The third portion extends parallel to the second portion.

Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (first wires) extend from a surface of the substrate. Second wire bond wires (second wires) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface of the packaging substrate, wherein each package layer is formed by subsequently forming a mounting layer, a sealant layer, and a wiring layer. Further, the method includes forming a top sealant layer and planting connection balls on the second functional surface of the packaging substrate.

Provided with a semiconductor apparatus which is able to be miniaturized and is provided with a Peltier element. The semiconductor apparatus is provided with a semiconductor substrate and the Peltier element which is disposed facing the semiconductor substrate. The Peltier element has a first substrate and a thermoelectric semiconductor which is disposed between the first substrate and the semiconductor substrate. The semiconductor substrate has a first electrode provided on a surface side facing the first substrate. The first substrate has a second electrode provided on a surface side facing the semiconductor substrate. The first electrodes and the second electrodes are each connected to the thermoelectric semiconductor.

A semiconductor package includes a package substrate having a first side portion adjacent to a first edge, and a second side portion adjacent to a second edge opposite the first edge; a plurality of first substrate pads on the package substrate at the first side portion of the package substrate; a first chip on the package substrate; a second chip stacked on the first chip in a step-wise manner to result in a first exposure region exposing a portion of a surface of the first chip with respect to the second chip due to the step-wise stacking, the first exposure region being adjacent to a first edge of the first chip; a plurality of first bonding pads on a first portion of the first exposure region, the first portion of the first exposure region being adjacent to the first edge of the first chip; a plurality of second bonding pads on a second portion of the first exposure region, the second portion of the first exposure region further from the first edge of the first chip than the first portion of the first exposure region is to the first edge of the first chip, the plurality of second bonding pads being electrically insulated from any circuit components in the first chip; a plurality of third bonding pads on a surface of the second chip; and a plurality of bonding wires electrically connecting the third bonding pads to the first substrate pads via the second bonding pads.

A memory device might include registers configured to store expected peak current magnitudes corresponding to a plurality of memory devices containing the memory device, and a controller configured to cause the memory device to determine whether to initiate a next phase of an access operation in response to at least a first sum of an expected peak current magnitude for the next phase of the access operation in a selected operating mode and the expected peak current magnitudes of each of the registers other than a respective register of the memory device relative to a first current demand budget, and a second sum of the expected peak current magnitude for the next phase of the access operation in the selected operating mode and the expected peak current magnitudes of each of the registers other than a respective register of the memory device relative to a second, lower, current demand budget.

Methods and apparatuses are provided to improve pin utilization within die architectures. In one example, a die package includes a first pin, a second pin, a first die, a second die, and a third die. The first die is electrically coupled to the first pin over a first interconnect, and to the second pin over a second interconnect. The first die is also electrically coupled to the second die over a third interconnect, and to the third die over a fourth interconnect. The first die is configured to receive a first signal over the first interconnect. Based on the first signal, the first die is configured to electrically connect the second interconnect to either the third interconnect, or the fourth interconnect. A second signal is received over the second interconnect, and is transmitted to the one of the third interconnect and the fourth interconnect electrically connected to the second interconnect.