A semiconductor integrated circuit device includes a flipflop circuit using vertical nanowire (VNW) FETs. A latch unit of the flipflop circuit includes: a feedback node; first p-type and n-type transistors each of which receives an input signal at one node and is connected to the feedback node at the other node; and second p-type and n-type transistors each connected to the feedback node at one node. In a standard cell, the tops of the first and second p-type and n-type transistors are connected to the feedback node.

A terminal cell includes: third and fourth nanosheets formed at the same positions as first and second nanosheets, respectively, in the Y direction; and first and second dummy gate interconnects surrounding the peripheries of the third and fourth nanosheets, respectively, in the Y direction. Faces of the first and third nanosheets on one side in the Y direction are exposed from a first gate interconnect and the first dummy gate interconnect, respectively. Faces of the second and fourth nanosheets on one side in the Y direction are exposed from a second gate interconnect and the second dummy gate interconnect, respectively.

A voltage level shifter cell, which is configured to convert voltage levels of input signals of multi-bits, includes: a first circuit area including a first voltage level shifter configured to convert a 1-bit first input signal from among the input signals; and a second circuit area including a second voltage level shifter configured to convert a 1-bit second input signal from among the input signals, wherein the first circuit area and the second circuit area share a first N-well to which a first power voltage is applied, and the first circuit area and the second circuit area share a second N-well to which a second power voltage is applied, wherein the first N-well is formed to extend in a first direction, and the first N-well and the second N-well are arranged to overlap in a second direction crossing the first direction.

The semiconductor structure includes a semiconductor substrate having active regions; field-effect devices disposed on the semiconductor substrate, the field-effect devices including gate stacks with elongated shape oriented in a first direction; a first metal layer disposed over the gate stacks, the first metal layer including first metal lines oriented in a second direction being orthogonal to the first direction; a second metal layer disposed over the first metal layer, the second metal layer including second metal lines oriented in the first direction; and a third metal layer disposed over the second metal layer, the third metal layer including third metal lines oriented in the second direction. The first, second, and third metal lines have a first thickness T.sub.1, a second thickness T.sub.2, and t a third thickness T.sub.3, respectively. The second thickness is greater than the first thickness and the third thickness.

Integrated circuit devices including standard cells are provided. The standard cells may include a first vertical field effect transistor (VFET) including a first channel region and having a first conductivity type and a second VFET including a second channel region and having a second conductivity type that is different from the first conductivity type. Each of the first channel region and the second channel region may extend longitudinally in a first horizontal direction, and the first channel region may be spaced apart from the second channel region in a second horizontal direction that is perpendicular to the first horizontal direction.

An integrated circuit including a first active region and a second active region extending in a first direction and spaced apart from each other in a second direction intersecting the first direction; a power rail and a ground rail extending in the first direction and spaced apart from the first and second active regions and each other in the second direction; source/drain contacts extending in the second direction on at least a portion of the first or second active region, gate structures extending in the second direction and on at least a portion of the first and second active regions, a power rail configured to supply power through source/drain contact vias, and a ground rail configured to supply a ground voltage through source/drain contact vias.

The semiconductor structure includes a semiconductor substrate having active regions; field-effect devices disposed on the semiconductor substrate, the field-effect devices including gate stacks with elongated shape oriented in a first direction; a first metal layer disposed over the gate stacks, the first metal layer including first metal lines oriented in a second direction being orthogonal to the first direction; a second metal layer disposed over the first metal layer, the second metal layer including second metal lines oriented in the first direction; and a third metal layer disposed over the second metal layer, the third metal layer including third metal lines oriented in the second direction. The first, second, and third metal lines have a first thickness T.sub.1, a second thickness T.sub.2, and t a third thickness T.sub.3, respectively. The second thickness is greater than the first thickness and the third thickness.

A semiconductor integrated circuit device includes a flipflop circuit using vertical nanowire (VNW) FETs. A latch unit of the flipflop circuit includes: a feedback node; first p-type and n-type transistors each of which receives an input signal at one node and is connected to the feedback node at the other node; and second p-type and n-type transistors each connected to the feedback node at one node. In a standard cell, the tops of the first and second p-type and n-type transistors are connected to the feedback node.

The semiconductor structure includes a semiconductor substrate having active regions; field-effect devices disposed on the semiconductor substrate, the field-effect devices including gate stacks with elongated shape oriented in a first direction; a first metal layer disposed over the gate stacks, the first metal layer including first metal lines oriented in a second direction being orthogonal to the first direction; a second metal layer disposed over the first metal layer, the second metal layer including second metal lines oriented in the first direction; and a third metal layer disposed over the second metal layer, the third metal layer including third metal lines oriented in the second direction. The first, second, and third metal lines have a first thickness T.sub.1, a second thickness T.sub.2, and t a third thickness T.sub.3, respectively. The second thickness is greater than the first thickness and the third thickness.

The semiconductor structure includes a semiconductor substrate having active regions; field-effect devices disposed on the semiconductor substrate, the field-effect devices including gate stacks with elongated shape oriented in a first direction; a first metal layer disposed over the gate stacks, the first metal layer including first metal lines oriented in a second direction being orthogonal to the first direction; a second metal layer disposed over the first metal layer, the second metal layer including second metal lines oriented in the first direction; and a third metal layer disposed over the second metal layer, the third metal layer including third metal lines oriented in the second direction. The first, second, and third metal lines have a first thickness T.sub.1, a second thickness T.sub.2, and t a third thickness T.sub.3, respectively. The second thickness is greater than the first thickness and the third thickness.