The present invention relates to a method for manufacturing a nonvolatile memory thin film device by using a neutral particle beam generation apparatus. The present invention solves the problem that substrates such as glass and a plastic film may not be used for manufacturing the memory thin film device due to the high temperature heat treatment process for a long time, in the existing method for manufacturing the thin film device having the nonvolatile memory function by forming the mobile proton layer.

In various embodiments of the disclosed subject matter, a method for forming a thin film transistor (TFT), a related TFT, array substrate, and display apparatus are provided. The method comprises: forming a pattern of an active layer on a base substrate and insulated from a gate electrode; forming a first initial ohmic contacting layer and a second initial ohmic contacting layer on the active layer; forming a source electrode on the first initial ohmic contacting layer, and a drain electrode on the second initial ohmic contacting layer; and performing a heating treatment to the base substrate having the source electrode and the drain electrode thereon, such that metal atoms in the source electrode diffuse to the first initial ohmic contacting layer to form a first ohmic contacting layer, and metal atoms in the drain electrode diffuse to the second initial ohmic contacting layer to form a second ohmic contacting layer.

A display device includes: a substrate; a touch electrode disposed on the substrate; a routing wiring disposed on the touch electrode; a light blocking layer disposed on the touch electrode; a semiconductor layer disposed on the light blocking layer; a source electrode and a drain electrode spaced apart from each other and disposed on the semiconductor layer; and a gate electrode disposed on the source electrode and the drain electrode.

A display device, and method for manufacture, having a substrate; a first thin film transistor (TFT) on the substrate, the first TFT having a first active layer, a first gate insulator, and a first gate electrode; a second TFT on the substrate, the second TFT having a second active layer, a second gate insulator and a second gate electrode. The first gate insulator is disposed between the first gate electrode and the first active layer, and the first gate insulator is in contact with the first active layer. The second gate insulator is disposed between the second gate electrode and the second active layer, and the second gate insulator is in contact with the second active layer. A material of the first active layer is different than a material of the second active layer, and a hydrogen concentration of the second gate insulator is different from a hydrogen concentration of the first gate insulator.

A display device includes: a substrate; a first thin film transistor unit disposed on the substrate and comprising a first active layer comprising a silicon layer, wherein the first active layer comprises a channel region, a source region and a drain region; a second thin film transistor unit disposed on the substrate and comprising a second active layer comprising a metal oxide layer; and a display medium disposed on the first thin film transistor unit and the second thin film transistor unit. Herein, a thickness of the silicon layer in the channel region is less than or equal to a thickness of the silicon layer in the source region.

A p channel TFT of a driving circuit has a single drain structure and its n channel TFT, an LDD structure. A pixel TFT has the LDD structure. A pixel electrode disposed in a pixel unit is connected to the pixel TFT through a hole bored in at least a protective insulation film formed of an inorganic insulating material and formed above a gate electrode of the pixel TFT, and in an inter-layer insulation film disposed on the insulation film in close contact therewith. These process steps use 6 to 8 photo-masks.

A radio frequency integrated circuit includes a silicon CMOS substrate with at least one CMOS device buried therein, and at least one thin film transistor formed on the silicon CMOS substrate and functioning as a radio frequency device. The thin film transistor includes a T-shaped gate electrode. A method for the fabricating a radio frequency integrated circuit is also disclosed.

A thin film transistor substrate includes a data line, a gate line, a gate electrode, a source electrode, a first drain electrode, a semiconductor layer and a second drain electrode. The data line and the gate line cross each other on a base substrate. The gate electrode is electrically connected to the gate line. The source electrode is electrically connected to the data line. The first drain electrode and the source electrode face each other. The semiconductor layer serves as a channel between the source electrode and the first drain electrode. The second drain electrode is disposed on the first drain electrode. The second drain electrode is electrically connected to the first drain electrode.

A method of manufacturing an electronic device comprising a first terminal (e.g. a source terminal), a second terminal (e.g. a drain terminal), a semiconductor channel connecting the first and second terminals and a gate terminal to which a potential may be applied to control a conductivity of the channel. The method comprises a first exposure of a photoresist from above the substrate using a mask and a second exposure from below, wherein in the second exposure the first and second terminals shield a part of the photoresist from exposure. An intermediate step reduces the solubility of the photoresist exposed in the first exposure. A window is formed in the photoresist at the location which was shielded by the mask, but exposed to radiation from below. Semiconductor material, dielectric material and conductor material are deposited inside the window to form a semiconductor channel, gate dielectric, and a gate terminal, respectively.

The present invention provides a semiconductor device that has a shorter distance between the bit lines and easily achieves higher storage capacity and density. The semiconductor device includes: first bit lines and an insulating layer that is provided between the first bit lines and in a groove. First faces of the first bit lines are aligned on a first line and second faces of the first bit lines are aligned on a second line. A first face of the insulating layer is disposed at a third line that is a first distance from the first line in a first direction and a second face of the insulating layer is disposed at a fourth line that is a second distance from the second line in a second direction.