H01L29/66765

PIXEL STRUCTURE AND FABRICATION METHOD THEREOF
20170263644 · 2017-09-14 ·

A pixel structure and a fabrication method thereof are provided, and the fabrication method includes steps as follows. A gate and a scan line connected to the gate electrode are formed on a substrate. An insulation layer is formed on the substrate and is patterned to form an opening corresponding to the gate electrode. A gate insulation layer is formed to cover the gate electrode and the scan line. A channel layer is formed on the gate insulation layer and is located in the opening. A first ohmic contact layer and a second ohmic contact layer are formed on the channel layer and are located in the opening. A source electrode, a drain electrode and a data line connected to the source electrode are formed on the first ohmic contact layer and the second ohmic contact layer. A first electrode is formed and is electrically connected to the drain electrode.

Manufacturing method of array substrate with reduced number of patterning processes array substrate and display device

An array substrate, a manufacturing method thereof and a display device are disclosed. Patterns comprising a gate, a gate insulating layer and a polysilicon active layer are formed on a base substrate by single patterning process. A passivation layer is formed on the substrate surface formed with the patterns, and patterns of a first via and a second via are formed on a surface of the passivation layer by single patterning process. Patterns of a source, a drain and a pixel electrode are formed on the substrate surface formed with the patterns by single patterning process. The source is electrically connected with the polysilicon active layer through the first via, and the drain is electrically connected with the polysilicon active layer through the second via. A pattern of pixel defining layer is formed on the substrate surface formed with the patterns by single patterning process.

THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING THE SAME, ARRAY SUBSTRATE, AND DISPLAY DEVICE

The present disclosure provides a TFT, its manufacturing method, an array substrate and a display device. The method includes steps of: forming a pattern of a gate electrode on a base substrate; forming a gate insulation layer with an even surface; forming a pattern of a polysilicon semiconductor layer; and forming patterns of a source electrode and a drain electrode. The step of forming the pattern of the polysilicon semiconductor layer includes: crystallizing the amorphous silicon layer, so as to form the polysilicon semiconductor layer.

CMOS STRUCTURE AND METHOD FOR MANUFACTURING CMOS STRUCTURE
20220045054 · 2022-02-10 ·

The disclosure relates to a CMOS structure and a manufacturing method thereof. The CMOS structure includes a substrate and an N-type TFT and a P-type TFT on the substrate. The N-type TFT includes a first gate electrode, a first active layer, and a first gate dielectric layer therebetween. The first active layer includes a first semiconductor layer, a second semiconductor layer of the N-type, and a third semiconductor layer of the N-type which are located at opposite ends of the first semiconductor layer and sequentially stacked in a direction away from the first gate dielectric layer. An N-type doping concentration of the second semiconductor layer is smaller than that of the third semiconductor layer. The P-type TFT includes a fifth semiconductor layer and a sixth semiconductor layer. A P-type doping concentration of the fifth semiconductor layer is smaller than that of the sixth semiconductor layer.

ARRAY SUBSTRATE AND METHOD OF MANUFACTURING SAME
20210408063 · 2021-12-30 ·

An array substrate and a method of manufacturing the same are provided. The array substrate includes a base substrate, a buffer layer, an active layer, a dielectric insulating layer, and a source/drain layer stacked in sequence. A trench is provided on a surface of the base substrate facing the buffer layer, and the trench is sunk to another surface of the base substrate. The array substrate further includes a gate layer. The gate layer is disposed in the trench of the base substrate. The buffer layer is disposed on the base substrate and totally covers the gate layer.

TFT ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

The present disclosure provides a TFT array substrate and a manufacturing method thereof. For the manufacturing method, a source electrode and a drain electrode are formed at first, and then edges of the source electrode and the drain electrode are used as masks to pattern a semiconductor layer to form an amorphous silicon island, which makes edges of the amorphous silicon island flush with the edges of the source electrode and the drain electrode, and completely removes the exposed semiconductor layer outside a metal layer, thereby decreasing photoelectric sensitivity of a TFT device, decreasing a size of the TFT device, and being beneficial for saving layouts and simplifying processes.

TFT ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

The present invention provides a thin-film transistor (TFT) array substrate and a manufacturing method thereof. The manufacturing method uses a four-mask process that uses an etch-stop layer on a semiconductor layer as a mask to perform alignment and etching to form a pattern of an amorphous silicon island. Tail fibers exposed outside of a source and a drain are removed, photoelectric sensitivity of a TFT device can be effectively reduced, and size of the TFT device is reduced, which can simplify processes, save layout space, and effectively increase display quality of large-size and high-resolution liquid crystal panels under high backlight intensity.

ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
20210408074 · 2021-12-30 ·

The present disclosure relates to an array substrate and a method for manufacturing the array substrate. The array substrate includes a substrate having a display region and a peripheral region surrounding the display region, the display region including sub-pixels arranged in an array, and a plurality of thin film transistors located on the substrate, including a plurality of first thin film transistors located within the peripheral region and a second thin film transistor located within each sub-pixel of the display region, wherein there is a first distance in a row and/or column direction between first active layers of the first thin film transistors and second active layers of nearest neighbor second thin film transistors, and there is a second distance in a row and/or column direction between adjacent second active layers, wherein the first distance is substantially equal to the second distance.

Array substrate, display panel and display device

The present application discloses an array substrate, a display panel and a display device. The array substrate comprises: a plurality of data lines and a plurality of gate lines, a plurality of pixel units defined by the plurality of data lines and the plurality of gate lines, each pixel unit comprising a first pixel electrode, a second pixel electrode, and at least three thin film transistors, the pixel unit further comprising: a charge-discharge element, the charge-discharge element and a third thin film transistor in the at least three thin film transistors charging and discharging the pixel unit such that the pixel unit forms a first voltage region and a second voltage region with different voltages.

DUAL-LAYER CHANNEL TRANSISTOR AND METHODS OF FORMING SAME

A transistor device and method of making the same, the transistor device including: a substrate; a word line disposed on the substrate; a gate insulating layer disposed on the word line; a dual-layer semiconductor channel including: a first channel layer disposed on the gate insulating layer; and a second channel layer disposed on the first channel layer, such that the second channel layer contacts side and top surfaces of the first channel layer; and source and drain electrodes electrically coupled to the second channel layer. When a voltage is applied to the word line, the first channel layer has a first electrical resistance and the second channel layer has a second electrical resistance that is different from the first electrical resistance.