Semiconductor devices and electronics packaging methods include integrated circuit chips having redundant signal bond pads along with signal bond pads connected to the same signal port for non-destructive testing of the integrated circuit chips prior to packaging. Electrical testing is made via the redundant signal bond after which qualified integrated circuit chips can be attached to a pristine and bumped final interposer or printed circuit board to provide increased reliability to the assembled electronic package.

Semiconductor devices and electronics packaging methods include integrated circuit chips having redundant signal bond pads along with signal bond pads connected to the same signal port for non-destructive testing of the integrated circuit chips prior to packaging. Electrical testing is made via the redundant signal bond after which qualified integrated circuit chips can be attached to a pristine and bumped final interposer or printed circuit board to provide increased reliability to the assembled electronic package.

A biosensor package structure is provided. The biosensor package structure includes a protection layer and a redistribution layer disposed over the protection layer. The protection layer has a plurality of openings exposing the redistribution layer. The biosensor package structure includes at least one die disposed over the protection layer and the redistribution layer, a plurality of pads disposed on a lower surface of the die, and a plurality of vias disposed between the pads and the redistribution layer. The biosensor package structure includes a dielectric material disposed over the protection layer and the redistribution layer and adjacent to the die, pads and vias. The biosensor package structure further includes at least one biosensing region at the top portion of the die. The top surfaces of the pads are disposed at a level that is lower than the top surface of the biosensing region and higher than the bottom surface of the die.

A biosensor package structure is provided. The biosensor package structure includes a protection layer and a redistribution layer disposed over the protection layer. The protection layer has a plurality of openings exposing the redistribution layer. The biosensor package structure includes at least one die disposed over the protection layer and the redistribution layer, a plurality of pads disposed on a lower surface of the die, and a plurality of vias disposed between the pads and the redistribution layer. The biosensor package structure includes a dielectric material disposed over the protection layer and the redistribution layer and adjacent to the die, pads and vias. The biosensor package structure further includes at least one biosensing region at the top portion of the die. The top surfaces of the pads are disposed at a level that is lower than the top surface of the biosensing region and higher than the bottom surface of the die.

An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

Methods for depositing material on a chip include forming a mold layer. The mold layer includes one or more openings over respective contact areas, each of the one or more openings having an upper volume and a lower volume. The upper volume has a smaller diameter than a diameter of the lower volume. Each contact area is within the respective lower volume. A material is injected into the one or more openings under pressure.

Methods for depositing material on a chip include forming a mold layer on a substrate. The mold layer has one or more openings over respective contact areas on the substrate. The one or more openings are formed from an upper volume and a lower volume, the upper volume having a smaller diameter than a diameter of the lower volume. A material is injected into the one or more openings under pressure, such that gas trapped in the one or more openings displaces into the lower volume until the injected material in the one or more openings makes contact with each respective contact area.

A method of manufacturing a bonding structure includes (a) providing a substrate, wherein the substrate includes a top surface and at least one bonding pad disposed adjacent to the top surface of the substrate, at least one bonding pad having a sloped surface with a first slope; (b) providing a semiconductor element, wherein the semiconductor element includes at least one pillar, and at least one pillar has a sidewall with a second slope, wherein the absolute value of the first slope is smaller than the absolute value of the second slope; and (c) bonding at least one pillar to a portion of the sloped surface of corresponding ones of the at least one bonding pad.

A method of manufacturing a layer structure includes: forming a first layer over a substrate; planarizing the first layer to form a planarized surface of the first layer; and forming a second layer over the planarized surface; wherein a porosity of the first layer is greater than a porosity of the substrate and greater than a porosity of the second layer; wherein the second layer is formed by physical vapor deposition; and wherein the first layer and the second layer are formed from the same solid material.