An array substrate has a display area and a bonding area located on a side of the display area. The array substrate includes a base, a plurality of first transistors, a plurality of conductive pins and a plurality of conductive electrodes. The plurality of first transistors are disposed on a side of the base and located in the display area; a first transistor includes a first gate, a first source and a first drain. The plurality of conductive pins are disposed on the side of the base and located in the bonding area, and are disposed in a same layer as the first gate. The plurality of conductive electrodes are each disposed on a respective one of surfaces of the plurality of conductive pins away from the base.

A power distribution network adapted to provide power to a plurality of components in an integrated circuit is provided. The power distribution network includes a power distribution trunk path, a plurality of first power distribution branch paths, and a plurality of second power distribution branch paths. The power distribution trunk path is used for transmitting the power. A long axis direction of the power distribution trunk path is a first direction. The first power distribution branch paths and the second power distribution branch paths are electrically connected to the power distribution trunk path. A long axis direction of the first power distribution branch paths is a second direction different from the first direction. A long axis direction of the second power distribution branch paths is a third direction different from the first direction and the second direction.

A device substrate comprising a substrate, a first pad, a second pad, a plurality of first power lines, a plurality of second power lines, and a plurality of control units is provided. The first pad is disposed on the first side of the device substrate. The second pad is disposed on the second side of the device substrate. The second side is opposite the first side. The first power lines are electrically connected to the first pad. The second power lines are electrically connected to the second pad. The control unit is electrically connected to at least one of the first power line and the second power line. The first pad does not overlap the second pad in a first direction perpendicular to the first side or in a second direction perpendicular to the second side. A display panel is also provided. A tiled display is also provided.

A display device includes a substrate and a first pad. The substrate includes a display area to display an image, and a pad area outside the display area. The first pad is in the pad area, and includes first pad terminals extending parallel to one another in a first direction. The first pad terminals include: first connection pad terminals arranged along a first column that forms a first slope angle with the first direction; second connection pad terminals spaced apart from the first connection pad terminals and arranged along a second column that forms a second slope angle with the first direction; and a first dummy pad terminal between a pair of adjacent first connection pad terminals among the first connection pad terminals along the first column. The first dummy pad terminal and the first connection pad terminals are in different layers than one another.

Semiconductor packages including active die stacks, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes an active die having a top surface covered by a molding compound, and a bonding pad attached to only one interconnect wire. A method of fabricating the semiconductor package includes bridging a pair of dies stacks by the interconnect wire, and dividing the interconnect wire to form separate wire segments attached to respective die stacks.

A semiconductor package includes a package substrate, semiconductor chips stacked on the package substrate, and electrical connectors that connect internal circuitry of each of the chips to the package substrate. Each of the semiconductor chips includes a chip selection pad for transmitting a chip selection signal to the internal circuitry of the semiconductor chip and a chip dummy pad, electrically isolated from the internal circuitry, along a first side of the semiconductor chip. The electrical connectors include a lower chip connector that electrically connects the package substrate to the chip selection pad of the lower semiconductor chip, a first auxiliary connector that electrically connects the package substrate to the chip dummy pad of the lower semiconductor chip, and a second auxiliary connector that electrically connects the chip dummy pad of the lower semiconductor chip to the chip selection pad of the upper semiconductor chip.

A power distribution network adapted to provide power to a plurality of components in an integrated circuit is provided. The power distribution network includes a power distribution trunk path, a plurality of first power distribution branch paths, and a plurality of second power distribution branch paths. The power distribution trunk path is used for transmitting the power. A long axis direction of the power distribution trunk path is a first direction. The first power distribution branch paths and the second power distribution branch paths are electrically connected to the power distribution trunk path. A long axis direction of the first power distribution branch paths is a second direction different from the first direction. A long axis direction of the second power distribution branch paths is a third direction different from the first direction and the second direction.

Semiconductor devices including stacked semiconductor dies and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a first semiconductor die coupled to a package substrate and a second semiconductor die stacked over the first semiconductor die and laterally offset from the first semiconductor die. The second semiconductor die can accordingly include an overhang portion that extends beyond a side of the first semiconductor die and faces the package substrate. In some embodiments, the second semiconductor die includes bond pads at the overhang portion that are electrically coupled to the package substrate via conductive features disposed therebetween. In certain embodiments, the first semiconductor die can include second bond pads electrically coupled to the package substrate via wire bonds.

A display device includes a display panel, a first film attached to the display panel, an adhesive member interposed between the display panel and the first film and extending in a first direction to attach the display panel to the first film, a first test electrode covered by the adhesive member; a second test electrode covered by the adhesive member and spaced apart from the first test electrode in a second direction perpendicular to the first direction, and test lines comprising a first test line electrically connected to the first test electrode and a second test line electrically connected to the second test electrode, where the adhesive member is disposed between the first test electrode and the second test electrode in the second direction.

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip. The first interconnection member includes a first insulating layer in contact with the second interconnection member, a first redistribution layer disposed on a surface of the first insulating layer in contact with the second interconnection member and electrically connected to the connection pads, and a blocking layer disposed on the surface of the first insulating layer on which the first redistribution layer is disposed and surrounding the through-hole.