A radar device includes: a substrate including multiple high-frequency conductor layers arranged on a front surface; a semiconductor component in contact with the high-frequency conductor layers via conductive members; and an adhesive that bonds the semiconductor component to the front surface of the substrate. The semiconductor component has a bottom surface and a first side surface facing in a first direction. All the multiple high-frequency conductor layers include at least high-frequency conductor layers bending in a plane of the front surface and thereby extend, on the front surface, from inside ends facing the bottom surface to outside ends positioned in the first direction from the first side surface. The adhesive is in contact with the front surface except for the sites of the multiple high-frequency conductor layers formed and in contact with the side surfaces of the semiconductor component.

A microelectronic device includes a die pad having a first surface and a second, opposite, surface. A first component is directly attached to the first surface of the die pad through a first thermally conductive material. A second component is directly attached to the second surface of the die pad through a second thermally conductive material. At least a portion of the second component overlaps at least a portion of the first component. The microelectronic device further includes a first thermal shunt connecting the die pad to a first lead, and a second thermal shunt connecting the die pad to a second lead. The first thermal shunt is closer to a center of the first component than to a center of the second component. The second thermal shunt is closer to a center of the second component than to a center of the first component.

An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.