Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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H01L2224/39
Structure, shape, material or disposition of the strap connectors after the connecting process
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H01L2224/40
of an individual strap connector
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H01L2224/40151
Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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H01L2224/40153
the body and the item being arranged next to each other, e.g. on a common substrate
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H01L2224/40155
the item being non-metallic, e.g. insulating substrate with or without metallisation
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H01L2224/40165
Connecting the strap to a via metallisation of the item
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H01L2224/40165

Direct Bonded Semiconductor Die Package
20250125231 · 2025-04-17 ·

Semiconductor device packages are provided. In one example, the semiconductor device package includes a semiconductor die. The semiconductor die includes a wide bandgap semiconductor material. The semiconductor die includes a metallization layer on a surface of the semiconductor die. The semiconductor device package includes a submount. The metallization of the semiconductor die is directly bonded to the submount.