A semiconductor package includes a package substrate, a plurality of first semiconductor chips stacked on an upper surface of the package substrate in a stair-step configuration, the plurality of first semiconductor chips having an uppermost semiconductor chip at a first height from the upper surface of the package substrate, the uppermost semiconductor chip including a free end portion. Conductive wires respectively electrically connect chip pads of the first semiconductor chips to substrate pads of the package substrate. A plurality of first support structures each have a first end attached to the upper surface of the package substrate and an opposite second end attached to the free end portion of the uppermost semiconductor chip. The first support structures are inclined at an angle relative to the package substrate.

Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.

Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.

A semiconductor package includes a semiconductor die, a tab, a first lead, and a continuous lead frame. The semiconductor die includes a first terminal, a second terminal, and a third terminal. The tab is electronically coupled to the first terminal. The semiconductor die is mounted on the tab. The first lead is electronically coupled to the second terminal. The continuous lead frame is electronically coupled to the third terminal and includes a second lead and a third lead.

A semiconductor package includes a semiconductor die, a tab, a first lead, and a continuous lead frame. The semiconductor die includes a first terminal, a second terminal, and a third terminal. The tab is electronically coupled to the first terminal. The semiconductor die is mounted on the tab. The first lead is electronically coupled to the second terminal. The continuous lead frame is electronically coupled to the third terminal and includes a second lead and a third lead.

In one example, an electronic device includes a substrate including a substrate first side, a conductive structure, and a substrate sidewall on the substrate first side. The substrate sidewall forms a perimeter, the substrate first side within the perimeter defines a substrate base, and the substrate sidewall and the substrate base form a substrate cavity. An electronic component includes a component first side, a component second side, and a component lateral side. The electronic component is disposed over a first portion of the substrate base within the substrate cavity and is coupled to the conductive structure. An encapsulant encapsulates at least a portion of the component lateral side, and a lid is over at least a portion of the component first side. At least a portion of the component first side is devoid of the encapsulant. Other examples and related methods are also disclosed herein.

A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.

A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.

A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.

A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.